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Journal Articles

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics

Margie Guerrero-Fernandez, Pedro Quintero, Ozan Cagatay Ozdemir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041107.
Paper No: EP-24-1022
https://doi.org/10.1115/1.4065943
Published Online: July 26, 2024
View Article titled, Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics
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Topics: Coating processes, Coatings, Copper, Plasma spraying, Spraying (Coating processes), Sprays, Surface roughness, Ceramics, Electronics, Experimental design
Journal Articles

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

Yang Liu, Zhao Li, Min Zhou, Xianghua Zeng, Fenglian Sun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031002.
Paper No: EP-20-1047
https://doi.org/10.1115/1.4049128
Published Online: January 19, 2021
View Article titled, Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint
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Topics: Bonding, Coating processes, Coatings, Composite materials, Mechanical behavior, Shear (Mechanics), Shear strength, Sintering, Fracture (Materials), Deformation
Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031119.
Paper No: EP-20-1022
https://doi.org/10.1115/1.4047847
Published Online: August 17, 2020
View Article titled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices
Open the PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices in another window
Topics: Coatings, Lasers, Manufacturing, Microcoolers, Micromachining, Silicon, Protective coatings, Bonding, Coating processes, Etching
Journal Articles

High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting

Yi Yang, Tao Long, Songlin Zhuang, Lai Wang, Yi Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031101.
Paper No: EP-19-1109
https://doi.org/10.1115/1.4046763
Published Online: April 17, 2020
View Article titled, High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting
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Topics: Coating processes, Coatings, Composite materials, Crystals, Density, Particulate matter, Phosphors, Power density, Lasers, Aluminum
Journal Articles

Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes Packaging

Bofeng Shang, Xingjian Yu, Huai Zheng, Bin Xie, Qi Chen, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021003.
Paper No: EP-15-1057
https://doi.org/10.1115/1.4033165
Published Online: April 19, 2016
View Article titled, Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes Packaging
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Topics: Coating processes, Computer simulation, Light-emitting diodes, Phosphors, Coatings, Packaging, Fluids
Journal Articles

Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth

Kenny Mahan, Yong Sun, Bongtae Han, Sungwon Han, Mike Osterman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031004.
Paper No: EP-13-1084
https://doi.org/10.1115/1.4026922
Published Online: May 5, 2014
View Article titled, Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth
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Topics: Adhesion, Coating processes, Coatings, Testing, Urethane elastomers, Pressure
Journal Articles

Fast Organic Conditioning of Patterned Surfaces for Capillary Part-to-Substrate Self-Assembly

M. Mastrangeli, K. Jans, T. Steylaerts, C. Van Hoof, J.-P. Celis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041008.
https://doi.org/10.1115/1.4002725
Published Online: November 24, 2010
View Article titled, Fast Organic Conditioning of Patterned Surfaces for Capillary Part-to-Substrate Self-Assembly
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Topics: Coating processes, Coatings, Electronic packaging, Self-assembly, Fluids, Water, Hydrophobicity
Journal Articles

High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer

Myung Jin Yim, Yi Li, Kyoung Sik Moon, C. P. Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011007.
https://doi.org/10.1115/1.4001229
Published Online: March 19, 2010
View Article titled, High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer
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Topics: Adhesives, Coating processes, Coatings, Copper, Particulate matter, Contact resistance, Anisotropy, Polymers, Fillers (Materials)
Journal Articles

Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer

M. A. Neidigk, Y.-L. Shen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011003.
https://doi.org/10.1115/1.3068298
Published Online: February 11, 2009
View Article titled, Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer
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Topics: Ceramics, Coating processes, Coatings, Computer simulation, Cooling, Epoxy resins, Failure, Ferrites (Magnetic materials), Finite element analysis, Manufacturing
Journal Articles

Investigation of Microporous Coatings and Mesoscale Evaporator Enhancements for Two-Phase Cooling of Electronic Components

Mark A. Trautman, Murli Tirumala, S. M. You
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011007.
https://doi.org/10.1115/1.2837509
Published Online: February 4, 2008
View Article titled, Investigation of Microporous Coatings and Mesoscale Evaporator Enhancements for Two-Phase Cooling of Electronic Components
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Topics: Boiling, Coatings, Cooling, Heat, Fluids, Fins, Heat conduction, Coating processes
Journal Articles

A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging

Anh X. H. Dang, I. Charles Ume, Swapan K. Bhattacharya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 86–91.
https://doi.org/10.1115/1.483152
Published Online: December 29, 1999
View Article titled, A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging
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Topics: Warping, Coating processes, Packaging, Temperature, Shades and shadows, Stainless steel
Journal Articles

Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

A.-F. Bastawros, K.-S. Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 354–359.
https://doi.org/10.1115/1.2792646
Published Online: December 1, 1998
View Article titled, Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors
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Topics: Damage, Electric current, Fracture (Materials), Thin films, Electrodes, Temperature, Aluminum, Melting, Brittle fracture, Coating processes
Journal Articles

Photothermal Reliability Testing of a Multilayer Coating—Substrate Assembly: A Theoretical Approach

T. Elperin, G. Rudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 82–88.
https://doi.org/10.1115/1.2792290
Published Online: March 1, 1998
View Article titled, Photothermal Reliability Testing of a Multilayer Coating—Substrate Assembly: A Theoretical Approach
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Topics: Accelerated life testing, Coating processes, Coatings, Manufacturing, Deflection, Pumps, Laser beams, Probes, Temperature, Thermal stresses
Journal Articles

Thermal Reliability of a Bilayer Slab Subjected to a Local Heat Source

T. Elperin, G. Rudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 37–43.
https://doi.org/10.1115/1.2905491
Published Online: March 1, 1994
View Article titled, Thermal Reliability of a Bilayer Slab Subjected to a Local Heat Source
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Topics: Heat, Reliability, Slabs, Coating processes, Coatings, Temperature, Thermal stresses, Stress tensors
Journal Articles

Coating of Electronic Components by the RTV Dispersion—Part I: Physical Model of the Deposition Process Determined by Drop Tests

J. A. Owczarek
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 233–239.
https://doi.org/10.1115/1.2909323
Published Online: September 1, 1993
View Article titled, Coating of Electronic Components by the RTV Dispersion—Part I: Physical Model of the Deposition Process Determined by Drop Tests
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Topics: Coating processes, Coatings, Electronic components, Yield stress, Circuits, Die cutting, Flow (Dynamics), Shear stress, Shearing (Deformation)
Journal Articles

Coating of Electronic Components by the RTV Dispersion—Part II: Determination of the Residual Yield Stress After Deposition, and Method to Produce a Drop of Required Cured Skin Thickness and Diameter

J. A. Owczarek
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 240–248.
https://doi.org/10.1115/1.2909324
Published Online: September 1, 1993
View Article titled, Coating of Electronic Components by the RTV Dispersion—Part II: Determination of the Residual Yield Stress After Deposition, and Method to Produce a Drop of Required Cured Skin Thickness and Diameter
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Topics: Coating processes, Coatings, Electronic components, Skin, Yield stress, Die cutting, Disperse systems, Electronic circuits, Flow (Dynamics), Shear stress
Journal Articles

Effects of Configuration on Plastic Package Stresses

L. T. Nguyen, S. A. Gee, W. F. v. d. Bogert
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 397–404.
https://doi.org/10.1115/1.2905426
Published Online: December 1, 1991
View Article titled, Effects of Configuration on Plastic Package Stresses
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Topics: Stress, Coating processes, Coatings, Compressive stress, Molding, Finite element analysis, Silicones, Simulation, Strain gages
Journal Articles

Oil Films on Electroplated Gold Contact Surfaces

R. G. Bayer, K. M. Conrow, P. A. Lazarou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1989, 111(3): 236–240.
https://doi.org/10.1115/1.3226539
Published Online: September 1, 1989
View Article titled, Oil Films on Electroplated Gold Contact Surfaces
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Topics: Coating processes, Coatings, Friction, Lubricants, Metallurgy, Microscopy, Polarization (Light), Shapes, Wear