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Journal Articles

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics

Margie Guerrero-Fernandez, Pedro Quintero, Ozan Cagatay Ozdemir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041107.
Paper No: EP-24-1022
https://doi.org/10.1115/1.4065943
Published Online: July 26, 2024
View Article titled, Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics
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Topics: Coating processes, Coatings, Copper, Plasma spraying, Spraying (Coating processes), Sprays, Surface roughness, Ceramics, Electronics, Experimental design
Journal Articles

Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling

Jimil M. Shah, Thomas Crandall, Phillip E. Tuma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041101.
Paper No: EP-22-1089
https://doi.org/10.1115/1.4062403
Published Online: May 15, 2023
View Article titled, Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling
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Topics: Boilers, Boiling, Bose-Einstein condensates, Cooling, Fluids, Junctions, Slug flows, Temperature, Thermal resistance, Vehicles
Journal Articles

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

Yang Liu, Zhao Li, Min Zhou, Xianghua Zeng, Fenglian Sun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031002.
Paper No: EP-20-1047
https://doi.org/10.1115/1.4049128
Published Online: January 19, 2021
View Article titled, Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint
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Topics: Bonding, Coating processes, Coatings, Composite materials, Mechanical behavior, Shear (Mechanics), Shear strength, Sintering, Fracture (Materials), Deformation
Journal Articles

A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones

Ali Nematollahisarvestani, Yung-Cheng “Y. C.” Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020802.
Paper No: EP-20-1043
https://doi.org/10.1115/1.4048011
Published Online: September 3, 2020
View Article titled, A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones
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Topics: Buckling, Deformation, Delamination, Failure, Fracture (Materials), Fracture (Process), Patents, Stress, Coatings
Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices

Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031119.
Paper No: EP-20-1022
https://doi.org/10.1115/1.4047847
Published Online: August 17, 2020
View Article titled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices
Open the PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices in another window
Topics: Coatings, Lasers, Manufacturing, Microcoolers, Micromachining, Silicon, Protective coatings, Bonding, Coating processes, Etching
Journal Articles

High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting

Yi Yang, Tao Long, Songlin Zhuang, Lai Wang, Yi Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031101.
Paper No: EP-19-1109
https://doi.org/10.1115/1.4046763
Published Online: April 17, 2020
View Article titled, High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting
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Topics: Coating processes, Coatings, Composite materials, Crystals, Density, Particulate matter, Phosphors, Power density, Lasers, Aluminum
Journal Articles

Study on Heat Transfer and Corrosion Resistance of Anodized Aluminum Alloy in Gallium-Based Liquid Metal

Yuntao Cui, Yujie Ding, Shuo Xu, Yushu Wang, Wei Rao, Jing Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011001.
Paper No: EP-18-1021
https://doi.org/10.1115/1.4041665
Published Online: February 25, 2019
View Article titled, Study on Heat Transfer and Corrosion Resistance of Anodized Aluminum Alloy in Gallium-Based Liquid Metal
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Topics: Aluminum alloys, Corrosion resistance, Gallium, Heat transfer, Liquid metals, Thermal conductivity, Oxidation, Heat, Coatings, Cooling
Journal Articles

Technological Advances to Maximize Solar Collector Energy Output: A Review

Swapnil S. Salvi, Vishal Bhalla, Robert A. Taylor, Vikrant Khullar, Todd P. Otanicar, Patrick E. Phelan, Himanshu Tyagi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2018, 140(4): 040802.
Paper No: EP-18-1036
https://doi.org/10.1115/1.4041219
Published Online: October 1, 2018
View Article titled, Technological Advances to Maximize Solar Collector Energy Output: A Review
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Topics: Coatings, Solar collectors, Solar energy
Journal Articles

Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes Packaging

Bofeng Shang, Xingjian Yu, Huai Zheng, Bin Xie, Qi Chen, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021003.
Paper No: EP-15-1057
https://doi.org/10.1115/1.4033165
Published Online: April 19, 2016
View Article titled, Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes Packaging
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Topics: Coating processes, Computer simulation, Light-emitting diodes, Phosphors, Coatings, Packaging, Fluids
Journal Articles

Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth

Kenny Mahan, Yong Sun, Bongtae Han, Sungwon Han, Mike Osterman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031004.
Paper No: EP-13-1084
https://doi.org/10.1115/1.4026922
Published Online: May 5, 2014
View Article titled, Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth
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Topics: Adhesion, Coating processes, Coatings, Testing, Urethane elastomers, Pressure
Journal Articles

Fast Organic Conditioning of Patterned Surfaces for Capillary Part-to-Substrate Self-Assembly

M. Mastrangeli, K. Jans, T. Steylaerts, C. Van Hoof, J.-P. Celis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041008.
https://doi.org/10.1115/1.4002725
Published Online: November 24, 2010
View Article titled, Fast Organic Conditioning of Patterned Surfaces for Capillary Part-to-Substrate Self-Assembly
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Topics: Coating processes, Coatings, Electronic packaging, Self-assembly, Fluids, Water, Hydrophobicity
Journal Articles

High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer

Myung Jin Yim, Yi Li, Kyoung Sik Moon, C. P. Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011007.
https://doi.org/10.1115/1.4001229
Published Online: March 19, 2010
View Article titled, High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer
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Topics: Adhesives, Coating processes, Coatings, Copper, Particulate matter, Contact resistance, Anisotropy, Polymers, Fillers (Materials)
Journal Articles

Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer

M. A. Neidigk, Y.-L. Shen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011003.
https://doi.org/10.1115/1.3068298
Published Online: February 11, 2009
View Article titled, Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer
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Topics: Ceramics, Coating processes, Coatings, Computer simulation, Cooling, Epoxy resins, Failure, Ferrites (Magnetic materials), Finite element analysis, Manufacturing
Journal Articles

Investigation of Microporous Coatings and Mesoscale Evaporator Enhancements for Two-Phase Cooling of Electronic Components

Mark A. Trautman, Murli Tirumala, S. M. You
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011007.
https://doi.org/10.1115/1.2837509
Published Online: February 4, 2008
View Article titled, Investigation of Microporous Coatings and Mesoscale Evaporator Enhancements for Two-Phase Cooling of Electronic Components
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Topics: Boiling, Coatings, Cooling, Heat, Fluids, Fins, Heat conduction, Coating processes
Journal Articles

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

K. M. B. Jansen, V. Gonda, L. J. Ernst, H. J. L. Bressers, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. December 2005, 127(4): 530–536.
https://doi.org/10.1115/1.2070092
Published Online: December 22, 2004
View Article titled, State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
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Topics: Deflection, Electromagnetic scattering, Film thickness, Nanoindentation, Polymer films, Polymers, Radiation scattering, Scattering (Physics), Stress, Thermomechanics
Journal Articles

Coatings Technology Handbook, Second Edition

D. Satas,, Editor,, Arthur A. Tracton,, Editor, and, Anthony J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. March 2002, 124(1): 67–68.
https://doi.org/10.1115/1.1446069
Published Online: March 1, 2002
View Article titled, Coatings Technology Handbook, Second Edition
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Topics: Coatings, Testing
Journal Articles

On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications

Jang-hi Im, Mem. ASME, Edward O. Shaffer, II, Theodore Stokich,, Jr., Andrew Strandjord, Jack Hetzner, James Curphy, Cheryl Karas, Greg Meyers, David Hawn, Ashok Chakrabarti, Steve Froelicher
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 28–33.
https://doi.org/10.1115/1.483128
Published Online: October 20, 1999
View Article titled, On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications
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Topics: Adhesion, Atomic force microscopy, Coatings, Polymers, Reliability, Thermal stability, Thin films, Fracture (Process), Fracture (Materials), Silicon
Journal Articles

Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

A.-F. Bastawros, K.-S. Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 354–359.
https://doi.org/10.1115/1.2792646
Published Online: December 1, 1998
View Article titled, Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors
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Topics: Damage, Electric current, Fracture (Materials), Thin films, Electrodes, Temperature, Aluminum, Melting, Brittle fracture, Coating processes
Journal Articles

Thermal Enhancement Coatings for Microelectronic Systems

L. S. Fletcher, M. A. Lambert, E. E. Marotta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 229–237.
https://doi.org/10.1115/1.2792627
Published Online: September 1, 1998
View Article titled, Thermal Enhancement Coatings for Microelectronic Systems
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Topics: Coatings, Electronic components, Failure, Heat
Journal Articles

A Review of Changes and Trends Affecting Military Electronics Manufacturing

A. J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 156–159.
https://doi.org/10.1115/1.2792608
Published Online: June 1, 1998
View Article titled, A Review of Changes and Trends Affecting Military Electronics Manufacturing
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Topics: Electronics, Manufacturing, Military systems, Defense industry, Aerospace industry, Coatings, Design, Proton exchange membranes