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Journal Articles

Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures

Nobuyuki Shishido, Yutaka Hayama, Yuki Akinaga, Shinya Taketomi, Masaaki Koganemaru, Seiya Hagihara, Noriyuki Miyazaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011010.
Paper No: EP-24-1039
https://doi.org/10.1115/1.4066100
Published Online: August 24, 2024
View Article titled, Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
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Topics: Creep, Cycles, Fatigue, Fracture (Materials), Fracture mechanics, Temperature, Wire, Computational methods, Finite element analysis
Journal Articles

A New Approach to Calculate Atomic Flux Divergence by Electromigration

K. Sasagawa, N. Nakamura, M. Saka, H. Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 360–366.
https://doi.org/10.1115/1.2792647
Published Online: December 1, 1998
View Article titled, A New Approach to Calculate Atomic Flux Divergence by Electromigration
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Topics: Electrodiffusion, Corners (Structural elements), Current density, Temperature, Computational methods
Journal Articles

Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink

S. Sathe, K. M. Kelkar, K. C. Karki, C. Tai, C. Lamb, S. V. Patankar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 58–63.
https://doi.org/10.1115/1.2792201
Published Online: March 1, 1997
View Article titled, Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink
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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Ceramics, Fins, Nozzles, Cooling, Heat, Temperature, Air flow
Journal Articles

Predicted Residual Bow of Thin Plastic Packages of Integrated Circuit Devices

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1992, 114(4): 467–470.
https://doi.org/10.1115/1.2905482
Published Online: December 1, 1992
View Article titled, Predicted Residual Bow of Thin Plastic Packages of Integrated Circuit Devices
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Topics: Computational methods, Design, Epoxy adhesives, Epoxy resins, Finite element analysis, Integrated circuits, Manufacturing, Metals, Printed circuit boards, Silicon
Journal Articles

Shape and Force Relationships for Molten Axisymmetric Solder Connections

R. H. Katyl, W. T. Pimbley
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 336–341.
https://doi.org/10.1115/1.2905460
Published Online: September 1, 1992
View Article titled, Shape and Force Relationships for Molten Axisymmetric Solder Connections
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Topics: Shapes, Solders, Collapse, Computational methods, Equilibrium (Physics), Gravity (Force), Surface tension