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Journal Articles

Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft

Joshua Kasitz, Aniket Ajay Lad, Muhammad Jahidul Hoque, Nenad Miljkovic, David Huitink

J. Electron. Packag. March 2023, 145(1): 011101.

Paper No: EP-22-1023

DOI: https://doi.org/10.1115/1.4055464

Published Online: September 27, 2022

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Topics: Aircraft, Cooling, Cooling systems, Flight, Heat exchangers, Stress, Temperature, Thermal management, Transients (Dynamics), Motors

Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome

J. Electron. Packag. June 2022, 144(2): 021110.

Paper No: EP-21-1048

DOI: https://doi.org/10.1115/1.4052767

Published Online: November 22, 2021

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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities

Journal Articles

Coupled Calculations of Data Center Cooling and Power Distribution Systems

Aaron P. Wemhoff, Faisal Ahmed

J. Electron. Packag. December 2022, 144(4): 041002.

Paper No: EP-21-1044

DOI: https://doi.org/10.1115/1.4052101

Published Online: October 6, 2021

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Topics: Cooling, Cooling systems, Data centers, Power systems (Machinery), Stress, Energy efficiency, Electronic systems, Uncertainty

Journal Articles

An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads

Sadegh Khalili, Srikanth Rangarajan, Vadim Gektin, Husam Alissa, Bahgat Sammakia

J. Electron. Packag. December 2020, 142(4): 041002.

Paper No: EP-19-1138

DOI: https://doi.org/10.1115/1.4048180

Published Online: September 4, 2020

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Topics: Coolants, Cooling, Cooling systems, Flow (Dynamics), Fluids, Heat, Manifolds, Pressure, Stress, Temperature

Journal Articles

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials

Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, David Huitink

J. Electron. Packag. December 2020, 142(4): 041108.

Paper No: EP-20-1019

DOI: https://doi.org/10.1115/1.4047497

Published Online: June 26, 2020

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Topics: Cooling, Electronics, Heat, Phase change materials, Reliability, Temperature, Thermal management, Heat sinks, Design, Convection

Journal Articles

Thermal Control Strategies for Reliable and Energy-Efficient Data Centers

Rehan Khalid, Aaron P. Wemhoff

J. Electron. Packag. December 2019, 141(4): 041004.

Paper No: EP-18-1058

DOI: https://doi.org/10.1115/1.4044129

Published Online: July 12, 2019

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Topics: Cooling systems, Data centers, Energy consumption, Flow (Dynamics), Reliability, Temperature, Energy efficiency, Simulation, Control equipment

Journal Articles

Failure Analysis of Direct Liquid Cooling System in Data Centers

Sami Alkharabsheh, Udaya L. N. Puvvadi, Bharath Ramakrishnan, Kanad Ghose, Bahgat Sammakia

J. Electron. Packag. June 2018, 140(2): 020902.

Paper No: EP-17-1094

DOI: https://doi.org/10.1115/1.4039137

Published Online: May 9, 2018

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Topics: Cooling systems, Data centers, Failure, Temperature, Cooling, Flow (Dynamics), Coolants

Journal Articles

Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a

Filippo Cataldo, John Richard Thome

J. Electron. Packag. June 2018, 140(2): 021002.

Paper No: EP-17-1125

DOI: https://doi.org/10.1115/1.4039706

Published Online: May 9, 2018

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Topics: Flow (Dynamics), Fluids, Heat, Refrigerants, Condensers (steam plant), Stress, Cooling systems, Temperature, Design, Natural convection

Journal Articles

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Nicolas Lamaison, Raffaele L. Amalfi, Todd Salamon, Jackson B. Marcinichen, John R. Thome

J. Electron. Packag. March 2018, 140(1): 010901.

Paper No: EP-17-1085

DOI: https://doi.org/10.1115/1.4039091

Published Online: March 2, 2018

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Topics: Condensers (steam plant), Flow (Dynamics), Heat, Secondary cells, Stress, Temperature, Subcooling, Cooling systems, Refrigerants, Electronics

Journal Articles

Steady State and Transient Experimentally Validated Analysis of Hybrid Data Centers

Tianyi Gao, Bahgat Sammakia, Emad Samadiani, Roger Schmidt

J. Electron. Packag. June 2015, 137(2): 021007.

Paper No: EP-14-1041

DOI: https://doi.org/10.1115/1.4029163

Published Online: June 1, 2015

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Topics: Cooling, Data centers, Doors, Failure, Heat exchangers, Steady state, Temperature, Water, Cooling systems, Air flow

Journal Articles

A New Analytical Approach for Dynamic Modeling of Passive Multicomponent Cooling Systems

A. Gholami, M. Ahmadi, M. Bahrami

J. Electron. Packag. September 2014, 136(3): 031010.

Paper No: EP-14-1011

DOI: https://doi.org/10.1115/1.4027509

Published Online: May 12, 2014

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Topics: Cooling systems, Flat heat pipes, Heat, Heat pipes, Heat sinks, Network models, Temperature, Thermal resistance, Dynamic testing (Materials), Transients (Dynamics)

Journal Articles

Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits

Satish G. Kandlikar

J. Electron. Packag. June 2014, 136(2): 024001.

Paper No: EP-13-1081

DOI: https://doi.org/10.1115/1.4027175

Published Online: April 29, 2014

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Topics: Cooling, Cooling systems, Design, Flow (Dynamics), Heat, Microchannels, Pressure drop, Computer cooling, Temperature, Coolants

Journal Articles

Thermal-Aware Microchannel Cooling of Multicore Processors: A Three-Stage Design Approach

Yubai Li, Dongzhi Guo, Shi-Chune Yao

J. Electron. Packag. June 2014, 136(2): 021002.

Paper No: EP-13-1053

DOI: https://doi.org/10.1115/1.4027174

Published Online: April 29, 2014

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Topics: Cooling, Design, Microchannels, Cooling systems

Journal Articles

Optimization of a Hybrid Double-Side Jet Impingement Cooling System for High-Power Light Emitting Diodes

Sun-Min Kim, Kwang-Yong Kim

J. Electron. Packag. March 2014, 136(1): 011010.

Paper No: EP-13-1054

DOI: https://doi.org/10.1115/1.4026536

Published Online: February 14, 2014

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Topics: Cooling, Cooling systems, Design, Impingement cooling, Light-emitting diodes, Optimization, Temperature, Numerical analysis, Flow (Dynamics), Pressure

Journal Articles

Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation

Nicolas Lamaison, Jackson Braz Marcinichen, John Richard Thome

J. Electron. Packag. September 2013, 135(3): 030908.

Paper No: EP-12-1088

DOI: https://doi.org/10.1115/1.4024590

Published Online: July 24, 2013

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Topics: Cooling, Flow (Dynamics), Heat, Simulation, Transients (Dynamics), Vapors, Two-phase flow, Temperature, Pipes, Steady state

Journal Articles

An Overview of the IBM Power 775 Supercomputer Water Cooling System

Michael J. Ellsworth, Jr., Gary F. Goth, Randy J. Zoodsma, Amilcar Arvelo, Levi A. Campbell, William J. Anderl

J. Electron. Packag. June 2012, 134(2): 020906.

DOI: https://doi.org/10.1115/1.4006140

Published Online: June 11, 2012

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Topics: Cooling systems, Water, Heat, Cooling, Electronics, Manufacturing

Journal Articles

Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System

Huy N. Phan, Dereje Agonafer

J. Electron. Packag. September 2011, 133(3): 031003.

DOI: https://doi.org/10.1115/1.4004847

Published Online: September 14, 2011

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Topics: Cooling, Currents, Design, Heat, Heat sinks, Temperature, Thermoelectric coolers, Thermoelectric cooling, Cooling systems, Computer software

Journal Articles

From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash

J. Electron. Packag. March 2011, 133(1): 011004.

DOI: https://doi.org/10.1115/1.4003274

Published Online: March 9, 2011

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Topics: Cooling, Cooling towers, Data centers, Temperature, Cooling systems, Heat, Modeling, Flow (Dynamics)

Journal Articles

The Thermal Design of a Next Generation Data Center: A Conceptual Exposition

Emad Samadiani, Yogendra Joshi, Farrokh Mistree

J. Electron. Packag. December 2008, 130(4): 041104.

DOI: https://doi.org/10.1115/1.2993151

Published Online: November 13, 2008

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Topics: Data centers, Design, Cooling, Cooling systems

Journal Articles

A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing

Matthew Sweetland, John H. Lienhard, V, Alexander H. Slocum

J. Electron. Packag. September 2008, 130(3): 031012.

DOI: https://doi.org/10.1115/1.2966437

Published Online: August 12, 2008

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Topics: Convection, Cooling, Lasers, Nozzles, Radiation (Physics), Temperature, Temperature control, Testing, Manifolds, Pressure

Journal citation

NARROW

Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Coupled Calculations of Data Center Cooling and Power Distribution Systems

An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials

Thermal Control Strategies for Reliable and Energy-Efficient Data Centers

Failure Analysis of Direct Liquid Cooling System in Data Centers

Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Steady State and Transient Experimentally Validated Analysis of Hybrid Data Centers

A New Analytical Approach for Dynamic Modeling of Passive Multicomponent Cooling Systems

Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits

Thermal-Aware Microchannel Cooling of Multicore Processors: A Three-Stage Design Approach

Optimization of a Hybrid Double-Side Jet Impingement Cooling System for High-Power Light Emitting Diodes

Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation

An Overview of the IBM Power 775 Supercomputer Water Cooling System

Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System

From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet

The Thermal Design of a Next Generation Data Center: A Conceptual Exposition

A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing

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