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Journal Articles

Improved Method of C O 2 Laser Cutting of Aluminum Nitride

Raathai Molian, Pranav Shrotriya, Pal Molian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2008, 130(2): 024501.
https://doi.org/10.1115/1.2912223
Published Online: May 8, 2008
View Article titled, Improved Method of C O 2 Laser Cutting of Aluminum Nitride
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Topics: Aluminum, Cutting, Fracture (Materials), Laser cutting, Lasers, Thermal stresses, Fracture (Process), Oxygen, Stress
Journal Articles

Singulation of Electronic Packages With Abrasive Waterjets

Mohamed Hashish
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2006, 128(4): 479–483.
https://doi.org/10.1115/1.2353328
Published Online: February 9, 2006
View Article titled, Singulation of Electronic Packages With Abrasive Waterjets
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Topics: Cutting, Strips, Nozzles, Machinery, Flow (Dynamics)
Journal Articles

Free Abrasive Machining in Slicing Brittle Materials With Wiresaw

Fuqian Yang, Research Assistant Professor, Imin Kao, Associate Professor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 254–259.
https://doi.org/10.1115/1.1348019
Published Online: August 30, 2000
View Article titled, Free Abrasive Machining in Slicing Brittle Materials With Wiresaw
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Topics: Abrasive machining, Abrasives, Brittleness, Cutting, Deformation, Fracture (Materials), Particulate matter, Stress, Wire, Modeling
Journal Articles

Effect of Tool Wear on Force and Quality in Dam-Bar Cutting of Integrated Circuit Packages

C. F. Cheung, W. B. Lee, W. M. Chiu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 34–41.
https://doi.org/10.1115/1.1322564
Published Online: July 6, 2000
View Article titled, Effect of Tool Wear on Force and Quality in Dam-Bar Cutting of Integrated Circuit Packages
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Topics: Cutting, Dams, Wear
Journal Articles

Interior Stress for Axisymmetric Abrasive Indentation in the Free Abrasive Machining Process: Slicing Silicon Wafers With Modern Wiresaw

F. Yang, I. Kao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 191–195.
https://doi.org/10.1115/1.2792683
Published Online: September 1, 1999
View Article titled, Interior Stress for Axisymmetric Abrasive Indentation in the Free Abrasive Machining Process: Slicing Silicon Wafers With Modern Wiresaw
Open the PDF for Interior Stress for Axisymmetric Abrasive Indentation in the Free Abrasive Machining Process: Slicing Silicon Wafers With Modern Wiresaw in another window
Topics: Abrasive machining, Semiconductor wafers, Stress, Abrasives, Manufacturing, Pressure, Shear stress, Slurries, Wire, Cutting
Journal Articles

Modeling Stresses of Contacts in Wire Saw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

J. Li, I. Kao, V. Prasad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 123–128.
https://doi.org/10.1115/1.2792595
Published Online: June 1, 1998
View Article titled, Modeling Stresses of Contacts in Wire Saw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production
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Topics: Modeling, Semiconductor wafers, Stress, Wire, Particulate matter, Cutting, Silicon, Abrasives, Fracture (Materials), Slurries
Journal Articles

Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw

R. K. Sahoo, V. Prasad, I. Kao, J. Talbott, K. P. Gupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 35–40.
https://doi.org/10.1115/1.2792283
Published Online: March 1, 1998
View Article titled, Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw
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Topics: Design, Semiconductor wafers, Wire, Cutting, Algorithms, Feedback, Finishes, Finite element methods, Fracture (Materials), Fracture (Process)
Journal Articles

Drill Wear Monitoring in Circuit Board Manufacturing Using Drilling Forces and Their Spectra

Ciro N. Ramirez, R. Joe Thornhill
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 342–348.
https://doi.org/10.1115/1.2905461
Published Online: September 1, 1992
View Article titled, Drill Wear Monitoring in Circuit Board Manufacturing Using Drilling Forces and Their Spectra
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Topics: Drilling, Drills (Tools), Manufacturing, Printed circuit boards, Spectra (Spectroscopy), Wear, Computer simulation, Cutting, Vibration