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Journal Articles

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Omidreza Ghaffari, Wei Tong, Yaser Nabavi Larimi, Chady al Sayed, Alireza Ganjali, Jean-François Morissette, Francis Grenier, Simon Jasmin, Luc Fréchette, Julien Sylvestre
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041103.
Paper No: EP-21-1083
https://doi.org/10.1115/1.4051943
Published Online: August 27, 2021
View Article titled, Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
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Topics: Boiling, Cooling, Dielectric liquids, Heat, Temperature, Copper, Flat heat pipes, Pool boiling, Critical heat flux, Subcooling
Journal Articles

Natural Convection Immersion Cooling With Enhanced Optical Performance of Light-Emitting Diode Systems

Enes Tamdogan, Mehmet Arik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041006.
Paper No: EP-14-1089
https://doi.org/10.1115/1.4031480
Published Online: October 15, 2015
View Article titled, Natural Convection Immersion Cooling With Enhanced Optical Performance of Light-Emitting Diode Systems
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Topics: Cooling, Heat transfer, Light-emitting diodes, Natural convection, Silicones, Heat conduction, Convection, Fluids, Domes (Structural elements), Coolants
Journal Articles

Natural Convection Heat Transfer From an Array of Rectangular Protrusions in an Enclosure Filled With Dielectric Liquid

Y. Joshi, M. D. Kelleher, M. Powell, E. I. Torres
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 138–147.
https://doi.org/10.1115/1.2905502
Published Online: June 1, 1994
View Article titled, Natural Convection Heat Transfer From an Array of Rectangular Protrusions in an Enclosure Filled With Dielectric Liquid
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Topics: Dielectric liquids, Heat transfer, Natural convection, Temperature, Boundary-value problems, Cooling, Electronic packages, Energy dissipation, Heat exchangers, Plates (structures)
Journal Articles

Reducing Inter-Chip Temperature Differences in Computers Using Vortex Generators in Forced Convection

S. V. Garimella, D. J. Schlitz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 410–415.
https://doi.org/10.1115/1.2909350
Published Online: December 1, 1993
View Article titled, Reducing Inter-Chip Temperature Differences in Computers Using Vortex Generators in Forced Convection
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Topics: Computers, Forced convection, Generators, Temperature, Vortices, Flow (Dynamics), Pressure drop, Reynolds number, Coolants, Cooling
Journal Articles

Subcooled Pool Boiling Critical Heat Flux in Dielectric Liquid Mixtures

T. Y. Tom Lee, Mali Mahalingam, Peter J. C. Normington
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1993, 115(1): 134–137.
https://doi.org/10.1115/1.2909294
Published Online: March 1, 1993
View Article titled, Subcooled Pool Boiling Critical Heat Flux in Dielectric Liquid Mixtures
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Topics: Critical heat flux, Dielectric liquids, Pool boiling, Subcooling, Boiling, Data collection, Phase transition temperature, Temperature
Journal Articles

Free Convection in a Discretely Heated Vertical Enclosure: Effects of Prandtl Number and Cavity Size

V. Prasad, M. Keyhani, R. Shen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 63–74.
https://doi.org/10.1115/1.2904343
Published Online: March 1, 1990
View Article titled, Free Convection in a Discretely Heated Vertical Enclosure: Effects of Prandtl Number and Cavity Size
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Topics: Cavities, Natural convection, Prandtl number, Flow (Dynamics), Temperature, Flow visualization, Dielectric liquids, Heat, Heat transfer coefficients, Rayleigh number
Journal Articles

Sensible Heating and Boiling Incipience in Free-Falling Dielectric Liquid Films

William J. Marsh, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1989, 111(1): 46–53.
https://doi.org/10.1115/1.3226508
Published Online: March 1, 1989
View Article titled, Sensible Heating and Boiling Incipience in Free-Falling Dielectric Liquid Films
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Topics: Boiling, Dielectric liquids, Heating, Heat transfer, Wetting, Fluids, Heat, Liquid films, Multi-chip modules, Surface tension