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Journal Articles

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

Fei Chong Ng, Mohamad Aizat Abas

J. Electron. Packag. December 2022, 144(4): 041009.

Paper No: EP-21-1137

DOI: https://doi.org/10.1115/1.4052920

Published Online: December 1, 2022

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Topics: Design, Flip-chip packages, Flow (Dynamics), Optimization, Fluids, Computer simulation

Journal Articles

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Ahmad R. Gharaibeh, Yaman M. Manaserh, Mohammad I. Tradat, Firas W. AlShatnawi, Scott N. Schiffres, Bahgat G. Sammakia

J. Electron. Packag. September 2022, 144(3): 031017.

Paper No: EP-21-1164

DOI: https://doi.org/10.1115/1.4054461

Published Online: May 19, 2022

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Topics: Flow (Dynamics), Heat sinks, Manifolds, Pressure drop, Thermal resistance, Design, Computer simulation, Fluids, Temperature, Heat transfer

Journal Articles

Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology

Mohammad I. Tradat, Yaman “Mohammad Ali” Manaserh, Ahmad Gharaibeh, Bahgat G. Sammakia, Dave Hall, Kourosh Nemati, Mark Seymour

J. Electron. Packag. September 2022, 144(3): 031015.

Paper No: EP-21-1151

DOI: https://doi.org/10.1115/1.4053890

Published Online: March 8, 2022

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Topics: Air flow, Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Pressure, Temperature, Tiles, Modeling

Journal Articles

A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification

Ghazal Mohsenian, Cong Hiep Hoang, Kourosh Nemati, Hussam Alissa, Mohammad Tradat, Najmeh Fallahtafti, Vahideh Radmard, Bruce Murray, Bahgat Sammakia

J. Electron. Packag. December 2022, 144(4): 041015.

Paper No: EP-21-1139

DOI: https://doi.org/10.1115/1.4053643

Published Online: February 23, 2022

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Topics: Air flow, Design, Stress, Flow (Dynamics), Control systems, Heat, Data centers, Inertia (Mechanics)

Journal Articles

Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator

Zhigang Gao, Tianhu Wang, Yuxin Yang, Xiaolong Shang, Junhua Bai, Peng Li

J. Electron. Packag. December 2022, 144(4): 041014.

Paper No: EP-21-1134

DOI: https://doi.org/10.1115/1.4053433

Published Online: February 7, 2022

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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Methane, Microchannels, Pressure, Electromechanical actuators

Journal Articles

Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics

Satyam Saini, Pardeep Shahi, Pratik Bansode, Jimil M. Shah, Dereje Agonafer

J. Electron. Packag. June 2022, 144(2): 024501.

Paper No: EP-21-1070

DOI: https://doi.org/10.1115/1.4053363

Published Online: January 28, 2022

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Topics: Computational fluid dynamics, Data centers, Heat sinks, Particulate matter, Simulation, Contamination, Flow (Dynamics), Particle flow

Journal Articles

Influence of Laser Soldering Temperatures on Through-Hole Component

Saifulmajdy A. Zahiri, Aizat Abas, M. F. M. Sharif, Fakhrozi Che Ani

J. Electron. Packag. December 2022, 144(4): 041006.

Paper No: EP-21-1075

DOI: https://doi.org/10.1115/1.4052175

Published Online: November 22, 2021

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Topics: Flow (Dynamics), Lasers, Soldering, Solders, Temperature, Lead-free solders, Finite volume methods, Pressure

Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang

J. Electron. Packag. December 2022, 144(4): 041003.

Paper No: EP-20-1094

DOI: https://doi.org/10.1115/1.4052275

Published Online: November 22, 2021

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Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging

Journal Articles

Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers

Pardeep Shahi, Apruv Pravin Deshmukh, Hardik Yashwant Hurnekar, Satyam Saini, Pratik Bansode, Rajesh Kasukurthy, Dereje Agonafer

J. Electron. Packag. December 2022, 144(4): 041008.

Paper No: EP-21-1115

DOI: https://doi.org/10.1115/1.4052324

Published Online: November 22, 2021

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Topics: Computational fluid dynamics, Cooling, Design, Flow (Dynamics), Flow control, Valves, Pressure drop

Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome

J. Electron. Packag. June 2022, 144(2): 021110.

Paper No: EP-21-1048

DOI: https://doi.org/10.1115/1.4052767

Published Online: November 22, 2021

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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities

Journal Articles

Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel

D. Sathish Kumar, S. Jayavel

J. Electron. Packag. December 2022, 144(4): 041007.

Paper No: EP-21-1084

DOI: https://doi.org/10.1115/1.4052537

Published Online: November 22, 2021

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Topics: Bifurcation, Flow (Dynamics), Heat transfer, Microchannels, Fluids, Entropy, Pressure drop

Journal Articles

Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

Cheng-Hui Lin, Yoonjin Won

J. Electron. Packag. December 2021, 143(4): 041112.

Paper No: EP-21-1105

DOI: https://doi.org/10.1115/1.4052790

Published Online: November 9, 2021

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Topics: Boiling, Bubbles, Critical heat flux, Electrodeposition, Heat transfer, Copper, Dynamics (Mechanics), Microscale devices, Fins, Flow (Dynamics)

Includes: Supplementary data

Journal Articles

Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling

Filippo Cataldo, Yuri Carmelo Crea

J. Electron. Packag. December 2021, 143(4): 041110.

Paper No: EP-21-1094

DOI: https://doi.org/10.1115/1.4052670

Published Online: November 5, 2021

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Topics: Condensers (steam plant), Heat, Stress, Flow (Dynamics), Temperature, Fluids, Modeling

Journal Articles

The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling

Ankur Miglani, Anali Soto, Justin A. Weibel, Suresh V. Garimella

J. Electron. Packag. December 2021, 143(4): 041107.

Paper No: EP-21-1114

DOI: https://doi.org/10.1115/1.4052532

Published Online: October 14, 2021

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Topics: Flow (Dynamics), Heating, Microchannels, Boiling

Journal Articles

Reduced Order Design Optimization of Liquid Cooled Heat Sinks

Aniket Ajay Lad, Kai A. James, William P. King, Nenad Miljkovic

J. Electron. Packag. December 2021, 143(4): 041105.

Paper No: EP-21-1112

DOI: https://doi.org/10.1115/1.4052400

Published Online: October 6, 2021

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Topics: Design, Flow (Dynamics), Optimization, Pressure drop, Heat sinks

Journal Articles

Recent Developments in Air Pumps for Thermal Management of Electronics

Tsrong-Yi Wen, Jia-Cheng Ye

J. Electron. Packag. September 2022, 144(3): 030802.

Paper No: EP-20-1109

DOI: https://doi.org/10.1115/1.4051970

Published Online: October 1, 2021

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Topics: Pumps, Flow (Dynamics), Diaphragms (Mechanical devices), Diaphragms (Structural), Fans, Electronics, Cooling

Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock

J. Electron. Packag. June 2022, 144(2): 021105.

Paper No: EP-21-1012

DOI: https://doi.org/10.1115/1.4052071

Published Online: September 24, 2021

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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat

Journal Articles

Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control

Qi Jin, John T. Wen, Shankar Narayanan

J. Electron. Packag. December 2021, 143(4): 041102.

Paper No: EP-21-1081

DOI: https://doi.org/10.1115/1.4051942

Published Online: August 20, 2021

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Topics: Compressors, Design, Flow (Dynamics), Heat, Oscillations, Pressure drop, Secondary cells, Stability, Stress, Valves

Journal Articles

Viability of Cryogenic Cooling to Reduce Processor Power Consumption

Alec Nordlund, Matthew Harrison, Joshua Gess

J. Electron. Packag. December 2021, 143(4): 041101.

Paper No: EP-21-1034

DOI: https://doi.org/10.1115/1.4051752

Published Online: August 9, 2021

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Topics: Coolants, Cooling, Energy consumption, Flow (Dynamics), Nitrogen, Temperature, Design, Leakage, Solenoids, Thermal stability

Journal Articles

Underfill Flow in Flip-Chip Encapsulation Process: A Review

Fei Chong Ng, Mohamad Aizat Abas

J. Electron. Packag. March 2022, 144(1): 010803.

Paper No: EP-21-1007

DOI: https://doi.org/10.1115/1.4050697

Published Online: August 6, 2021

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Topics: Flow (Dynamics), Flip-chip, Fluids, Optimization, Design, Reliability

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Journal citation

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Supplemental Material

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology

A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification

Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator

Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics

Influence of Laser Soldering Temperatures on Through-Hole Component

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel

Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling

The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling

Reduced Order Design Optimization of Liquid Cooled Heat Sinks

Recent Developments in Air Pumps for Thermal Management of Electronics

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control

Viability of Cryogenic Cooling to Reduce Processor Power Consumption

Underfill Flow in Flip-Chip Encapsulation Process: A Review

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