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Journal Articles

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

Fabio Battaglia, Farah Singer, David C. Deisenroth, Michael M. Ohadi

J. Electron. Packag. September 2021, 143(3): 031006.

Paper No: EP-19-1118

DOI: https://doi.org/10.1115/1.4049564

Published Online: February 19, 2021

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Topics: Cooling, Flow (Dynamics), Heat, Heat flux, Microchannels, Pumps, Refrigerants, Temperature, Electronics, Flux (Metallurgy)

Journal Articles

Thermal Modeling of Microfluidic Channels for Cooling High Power Resistors on Multilayer Organic Liquid Crystal Polymer Substrate

Outmane Lemtiri Chlieh, Wasif T. Khan, John Papapolymerou

J. Electron. Packag. September 2015, 137(3): 031009.

Paper No: EP-14-1104

DOI: https://doi.org/10.1115/1.4030643

Published Online: September 1, 2015

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Topics: Cooling, Flow (Dynamics), Heat, Manufacturing, Microchannels, Microfluidics, Resistors, Temperature, Thermal resistance, Water

Journal Articles

Performance of Hybrid Fin Heat Sinks for Thermal Control of Light Emitting Diode Lighting Modules

Kyoung Joon Kim

J. Electron. Packag. March 2014, 136(1): 011002.

Paper No: EP-13-1047

DOI: https://doi.org/10.1115/1.4025673

Published Online: November 22, 2013

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Topics: Forced convection, Heat sinks, Light-emitting diodes, Natural convection, Temperature, Heat

Journal Articles

Optimization of Parallel, Horizontal, and Laminar Forced Air-Cooled Heat Generating Boards

M. O. Özdemir, H. Yüncü

J. Electron. Packag. September 2011, 133(3): 031006.

DOI: https://doi.org/10.1115/1.4004097

Published Online: September 14, 2011

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Topics: Flow (Dynamics), Forced convection, Heat, Heat transfer, Lumber, Optimization, Pressure, Pressure drop, Temperature, Laminar flow

Journal Articles

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, John Janssen, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz

J. Electron. Packag. March 2011, 133(1): 011003.

DOI: https://doi.org/10.1115/1.4003217

Published Online: March 3, 2011

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Topics: Boundary-value problems, Errors, Flow (Dynamics), Heat, Junctions, Natural convection, Temperature, Computational fluid dynamics, Optimization, Forced convection

Journal Articles

Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules

Giulio Lorenzini, Simone Moretti

J. Electron. Packag. September 2009, 131(3): 031012.

DOI: https://doi.org/10.1115/1.3144152

Published Online: July 31, 2009

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Topics: Fins, Heat, Heat exchangers, Pressure, Shapes, Temperature, Thermal conductivity, Ducts, Reynolds number, Optimization

Journal Articles

Modeling Forced Convection in Finned Metal Foam Heat Sinks

Christopher T. DeGroot, Anthony G. Straatman, Lee J. Betchen

J. Electron. Packag. June 2009, 131(2): 021001.

DOI: https://doi.org/10.1115/1.3103934

Published Online: March 27, 2009

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Topics: Aluminum, Computational fluid dynamics, Fins, Heat sinks, Heat transfer, Thermal conductivity, Fluids, Flow (Dynamics), Metal foams, Forced convection

Journal Articles

Turbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed Channels

E. Elsaadawy, H. Mortazavi, M. S. Hamed

J. Electron. Packag. September 2008, 130(3): 031011.

DOI: https://doi.org/10.1115/1.2912182

Published Online: August 5, 2008

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Topics: Turbulence, Forced convection, Shear stress

Journal Articles

A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages

Sandeep S. Tonapi, Sanjeev B. Sathe, Bahgat G. Sammakia, K. Srihari

J. Electron. Packag. December 2006, 128(4): 305–310.

DOI: https://doi.org/10.1115/1.2351891

Published Online: February 10, 2006

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Topics: Air flow, Ball-Grid-Array packages, Energy dissipation, Forced convection, Heat, Heat transfer, Numerical analysis, Temperature, Junctions, Temperature distribution

Journal Articles

Meso Scale Pulsating Jets for Electronics Cooling

Jivtesh Garg, Mehmet Arik, Stanton Weaver, Todd Wetzel, Seyed Saddoughi

J. Electron. Packag. December 2005, 127(4): 503–511.

DOI: https://doi.org/10.1115/1.2065727

Published Online: April 20, 2005

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Topics: Heat, Heat flux, Heat transfer, Heat transfer coefficients, Jets, Natural convection, Temperature, Temperature measurement, Thermal management, Cooling

Journal Articles

Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet

Jeffrey Rambo, Yogendra Joshi

J. Electron. Packag. December 2005, 127(4): 452–459.

DOI: https://doi.org/10.1115/1.2056575

Published Online: February 11, 2005

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Topics: Air flow, Blades, Computational fluid dynamics, Cooling, Energy dissipation, Entropy, Flow (Dynamics), Temperature, Thermal management, Heat

Journal Articles

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

K. Ramakrishna, Fellow ASME,, T.-Y. Tom Lee, Mem. ASME,

J. Electron. Packag. December 2004, 126(4): 449–456.

DOI: https://doi.org/10.1115/1.1827260

Published Online: January 24, 2005

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Topics: Flat heat pipes, Forced convection, Mixed convection, Natural convection, Printed circuit boards, Thermal conductivity, Thermal resistance, Heat transfer, Copper, Junctions

Journal Articles

Analyses of Convection Heat Transfer From Discrete Heat Sources in a Vertical Rectangular Channel

H. Bhowmik, C. P. Tso, K. W. Tou

J. Electron. Packag. September 2005, 127(3): 215–222.

DOI: https://doi.org/10.1115/1.1938207

Published Online: August 9, 2004

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Topics: Computer simulation, Convection, Flow (Dynamics), Forced convection, Heat, Water, Heat flux, Fluids, Laminar flow, Reynolds number

Journal Articles

An Experimental Study of Transient Heat Transfer From Discrete Heat Sources in Water Cooled Vertical Rectangular Channel

H. Bhowmik, K. W. Tou

J. Electron. Packag. September 2005, 127(3): 193–199.

DOI: https://doi.org/10.1115/1.1997155

Published Online: July 13, 2004

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Topics: Flow (Dynamics), Forced convection, Heat, Heat transfer, Laminar flow, Pumps, Temperature, Transient heat transfer, Transients (Dynamics), Water

Journal Articles

A Vapotron Effect Application for Electronic Equipment Cooling

Giulio Lorenzini, Cesare Biserni

J. Electron. Packag. December 2003, 125(4): 475–479.

DOI: https://doi.org/10.1115/1.1615796

Published Online: December 15, 2003

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Topics: Boiling, Cavities, Cooling, Electronic equipment, Fluids, Forced convection, Heat transfer coefficients, Heating, Refrigerants, Temperature

Journal Articles

Comparison Between the Standard and Staggered Layout for Cooling Fins in Forced Convection Cooling

Octavio Leon, Gilbert De Mey, Erik Dick, Jan Vierendeels

J. Electron. Packag. September 2003, 125(3): 442–446.

DOI: https://doi.org/10.1115/1.1602709

Published Online: September 17, 2003

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Topics: Cooling, Fins, Flow (Dynamics), Pressure drop, Heat, Heat transfer, Heat sinks, Coolants, Forced convection

Journal Articles

Local Heat Transfer Characteristics in Simulated Electronic Modules

Seong-Yeon Yoo, Jong-Hark Park, Min-Ho Chung

J. Electron. Packag. September 2003, 125(3): 362–368.

DOI: https://doi.org/10.1115/1.1602478

Published Online: September 17, 2003

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Topics: Generators, Heat transfer, Vortices, Flow (Dynamics), Heat transfer coefficients, Wakes, Forced convection

Journal Articles

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate

Alfonso Ortega, Shankar Ramanathan

J. Electron. Packag. June 2003, 125(2): 235–243.

DOI: https://doi.org/10.1115/1.1569507

Published Online: June 10, 2003

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Topics: Cooling, Electrical conductivity, Electronic components, Flow (Dynamics), Forced convection, Heat, Heat conduction, Heat transfer, Temperature, Thermal conductivity

Journal Articles

Optimal Internal Structure of Volumes Cooled by Single-Phase Forced and Natural Convection

Adrian Bejan, Fellow ASME, J. A. Jones Professor of Mechanical Engineering,

J. Electron. Packag. June 2003, 125(2): 200–207.

DOI: https://doi.org/10.1115/1.1566970

Published Online: June 10, 2003

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Topics: Boundary layers, Cooling, Flow (Dynamics), Forced convection, Heat, Natural convection, Temperature, Fluids, Design, Plates (structures)

Journal Articles

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion

Peter J. Rodgers, Vale´rie C. Eveloy, Mark R. Davies

J. Electron. Packag. March 2003, 125(1): 76–83.

DOI: https://doi.org/10.1115/1.1533060

Published Online: March 14, 2003

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Topics: Computer software, Flow (Dynamics), Forced convection, Heat transfer, Junctions, Modeling, Temperature, Thermal conductivity, Errors, Computational fluid dynamics

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Journal citation

NARROW

Experimental Characterization of Two-Phase Cooling of Power Electronics in Thermosiphon and Forced Convection Modes

Thermal Modeling of Microfluidic Channels for Cooling High Power Resistors on Multilayer Organic Liquid Crystal Polymer Substrate

Performance of Hybrid Fin Heat Sinks for Thermal Control of Light Emitting Diode Lighting Modules

Optimization of Parallel, Horizontal, and Laminar Forced Air-Cooled Heat Generating Boards

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules

Modeling Forced Convection in Finned Metal Foam Heat Sinks

Turbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed Channels

A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages

Meso Scale Pulsating Jets for Electronics Cooling

Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

Analyses of Convection Heat Transfer From Discrete Heat Sources in a Vertical Rectangular Channel

An Experimental Study of Transient Heat Transfer From Discrete Heat Sources in Water Cooled Vertical Rectangular Channel

A Vapotron Effect Application for Electronic Equipment Cooling

Comparison Between the Standard and Staggered Layout for Cooling Fins in Forced Convection Cooling

Local Heat Transfer Characteristics in Simulated Electronic Modules

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate

Optimal Internal Structure of Volumes Cooled by Single-Phase Forced and Natural Convection

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion

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