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Journal Articles

Special Issue on InterPACK2022

Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Article titled, Special Issue on InterPACK2022
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Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging

Swapnil S. Salvi, Ankur Jain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020901.
Paper No: EP-20-1058
https://doi.org/10.1115/1.4049291
Published Online: February 22, 2021
View Article titled, Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging
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Topics: Algorithms, Circuits, Hardware, Heating, Image processing, Imaging, Resistors, Semiconductors (Materials), Temperature, Integrated circuits
Journal Articles

Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management

Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2017, 139(1): 010801.
Paper No: EP-16-1092
https://doi.org/10.1115/1.4035019
Published Online: November 23, 2016
View Article titled, Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management
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Topics: Circuits, Computers, Printed circuit boards, Hardware
Journal Articles

A Holistic Evaluation of Data Center Water Cooling Total Cost of Ownership

Dustin W. Demetriou, Vinod Kamath, Howard Mahaney
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010912.
Paper No: EP-15-1100
https://doi.org/10.1115/1.4032494
Published Online: March 10, 2016
View Article titled, A Holistic Evaluation of Data Center Water Cooling Total Cost of Ownership
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Topics: Cooling, Data centers, Hardware, Water
Journal Articles

Intermittent Failures in Hardware and Software

Roozbeh Bakhshi, Surya Kunche, Michael Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011014.
Paper No: EP-13-1111
https://doi.org/10.1115/1.4026639
Published Online: February 18, 2014
View Article titled, Intermittent Failures in Hardware and Software
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Topics: Computer software, Failure, Hardware
Journal Articles

Software “Reliability”?

Robert S. Hanmer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 357–360.
https://doi.org/10.1115/1.1289630
Published Online: January 26, 2000
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Topics: Computer software, Errors, Hardware, Reliability, Failure
Journal Articles

Applications of Digital Speckle Correlation to Microscopic Strain Measurement and Materials’ Property Characterization

H. Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 275–279.
https://doi.org/10.1115/1.2792633
Published Online: September 1, 1998
View Article titled, Applications of Digital Speckle Correlation to Microscopic Strain Measurement and Materials’ Property Characterization
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Topics: Hardware, Manufacturing, Reliability, Resolution (Optics), Strain measurement
Journal Articles

Immersion-Cooled Standard Electronic Clamshell Module: A Building Block for Future High-Flux Avionic Systems

Issam Mudawar, Peter E. Jimenez, Robert E. Morgan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 116–125.
https://doi.org/10.1115/1.2905499
Published Online: June 1, 1994
View Article titled, Immersion-Cooled Standard Electronic Clamshell Module: A Building Block for Future High-Flux Avionic Systems
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Topics: Aluminum, Blocks (Building materials), Boiling, Cavities, Condensed matter, Coolants, Cooling, Energy dissipation, Flow (Dynamics), Hardware
Journal Articles

Temperature Mapping of Localized Hot Spots on Microelectronic Chip Surfaces

S. Heng, W. Z. Black
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 286–293.
https://doi.org/10.1115/1.2905408
Published Online: September 1, 1991
View Article titled, Temperature Mapping of Localized Hot Spots on Microelectronic Chip Surfaces
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Topics: Temperature, Emissivity, Image processing, Temperature measurement, Computer software, Computers, Hardware, Heat flux, Infrared imaging, Overlays (Materials engineering)
Journal Articles

A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging

R. G. Ross, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 121–128.
https://doi.org/10.1115/1.2905377
Published Online: June 1, 1991
View Article titled, A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging
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Topics: Electronic packaging, Fatigue, Solder joints, Space vehicles, Cycles, Hardware, Failure, Flight, Solders, Design
Journal Articles

Parametric Investigation Into the Effects of Pressure, Subcooling, Surface Augmentation and Choice of Coolant on Pool Boiling in the Design of Cooling Systems for High-Power-Density Electronic Chips

I. Mudawar, T. M. Anderson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 375–382.
https://doi.org/10.1115/1.2904392
Published Online: December 1, 1990
View Article titled, Parametric Investigation Into the Effects of Pressure, Subcooling, Surface Augmentation and Choice of Coolant on Pool Boiling in the Design of Cooling Systems for High-Power-Density Electronic Chips
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Topics: Coolants, Cooling systems, Density, Design, Pool boiling, Pressure, Subcooling, Boiling, Critical heat flux, Temperature