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Journal Articles

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

Jimil M. Shah, Keerthivasan Padmanaban, Hrishabh Singh, Surya Duraisamy Asokan, Satyam Saini, Dereje Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021109.
Paper No: EP-21-1016
DOI: https://doi.org/10.1115/1.4052536
Published Online: October 14, 2021
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Topics: Cables, Cooling, Cycles, Fluids, Mineral oil, Printed circuit boards, Reliability, Temperature, Capacitance, Optical cables
Journal Articles

Reliability Considerations for Oil Immersion-Cooled Data Centers

Jimil M. Shah, Richard Eiland, Pavan Rajmane, Ashwin Siddarth, Dereje Agonafer, Veerendra Mulay
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021007.
Paper No: EP-18-1050
DOI: https://doi.org/10.1115/1.4042979
Published Online: April 10, 2019
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Topics: Cooling, Data centers, Mineral oil, Printed circuit boards, Reliability, Temperature, Testing, Capacitors, Viscosity
Journal Articles

Thermal Performance and Efficiency of a Mineral Oil Immersed Server Over Varied Environmental Operating Conditions

Richard Eiland, John Edward Fernandes, Marianna Vallejo, Ashwin Siddarth, Dereje Agonafer, Verrendra Mulay
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041005.
Paper No: EP-17-1020
DOI: https://doi.org/10.1115/1.4037526
Published Online: September 7, 2017
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Topics: Cooling, Flow (Dynamics), Mineral oil, Temperature, Energy consumption, Data centers, Testing, Fluids
Journal Articles

Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance

Yunsheng Xu, Xiangcheng Luo, D. D. L. Chung
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 128–131.
DOI: https://doi.org/10.1115/1.483144
Published Online: December 28, 1999
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Topics: Contact resistance, Particulate matter, Silicones, Sodium, Thermal conductivity, Boron, Water, Copper, Fillers (Materials), Solders