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Journal Articles

Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review

Tolga Emir, Hamza Ourabi, Mete Budakli, Mehmet Arik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2022, 144(4): 040801.
Paper No: EP-21-1129
https://doi.org/10.1115/1.4054184
Published Online: April 28, 2022
View Article titled, Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review
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Topics: Boiling, Bubbles, Critical heat flux, Heat transfer, Pool boiling, Pressure, Nucleation (Physics), Fluids, Water, Heat
Journal Articles

Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

Cheng-Hui Lin, Yoonjin Won
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041112.
Paper No: EP-21-1105
https://doi.org/10.1115/1.4052790
Published Online: November 9, 2021
View Article titled, Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces
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Topics: Boiling, Bubbles, Critical heat flux, Electrodeposition, Heat transfer, Copper, Dynamics (Mechanics), Microscale devices, Fins, Flow (Dynamics)
Includes: Supplementary data
Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
https://doi.org/10.1115/1.4052071
Published Online: September 24, 2021
View Article titled, A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics
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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat
Journal Articles

Heterogeneous Void Nucleation Study in Flip Chip Assembly Process Using No-Flow Underfill

Sangil Lee, Daniel F. Baldwin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011005.
Paper No: EP-12-1068
https://doi.org/10.1115/1.4026164
Published Online: December 31, 2013
View Article titled, Heterogeneous Void Nucleation Study in Flip Chip Assembly Process Using No-Flow Underfill
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Topics: Flow (Dynamics), Nucleation (Physics), Temperature, Manufacturing, Solders
Journal Articles

Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

C. Basaran, H. Ye, D. C. Hopkins, D. Frear, J. K. Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 157–163.
https://doi.org/10.1115/1.1898338
Published Online: September 15, 2004
View Article titled, Failure Modes of Flip Chip Solder Joints Under High Electric Current Density
Open the PDF for Failure Modes of Flip Chip Solder Joints Under High Electric Current Density in another window
Topics: Current density, Electrodiffusion, Failure, Flip-chip, Flip-chip devices, Solder joints, Failure mechanisms, Nucleation (Physics)
Journal Articles

Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation

Pradeep Sharma, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 292–297.
https://doi.org/10.1115/1.1493202
Published Online: July 26, 2002
View Article titled, Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation
Open the PDF for Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation in another window
Topics: Creep, Damage, Fatigue, Grain boundaries, Nucleation (Physics), Solders, Stress, Particulate matter, Micromechanics (Engineering)
Journal Articles

A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling

A. Chandra, Y. Huang, Z. Q. Jiang, K. X. Hu, G. Fu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 220–226.
https://doi.org/10.1115/1.1286100
Published Online: November 5, 1999
View Article titled, A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling
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Topics: Damage, Fracture (Materials), Nucleation (Physics), Stress, Cycles, Microscale devices
Journal Articles

A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys

Z. Qian, W. Ren, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 162–168.
https://doi.org/10.1115/1.2792679
Published Online: September 1, 1999
View Article titled, A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys
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Topics: Alloys, Damage, Fatigue, Solders, Viscoplasticity, Constitutive equations, Creep, Damage mechanics, Deformation, Elasticity
Journal Articles

Interior Stress for Axisymmetric Abrasive Indentation in the Free Abrasive Machining Process: Slicing Silicon Wafers With Modern Wiresaw

F. Yang, I. Kao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 191–195.
https://doi.org/10.1115/1.2792683
Published Online: September 1, 1999
View Article titled, Interior Stress for Axisymmetric Abrasive Indentation in the Free Abrasive Machining Process: Slicing Silicon Wafers With Modern Wiresaw
Open the PDF for Interior Stress for Axisymmetric Abrasive Indentation in the Free Abrasive Machining Process: Slicing Silicon Wafers With Modern Wiresaw in another window
Topics: Abrasive machining, Semiconductor wafers, Stress, Abrasives, Manufacturing, Pressure, Shear stress, Slurries, Wire, Cutting
Journal Articles

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

S. Kamiya, H. Takahashi, M. Saka, H. Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 367–371.
https://doi.org/10.1115/1.2792648
Published Online: December 1, 1998
View Article titled, Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles
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Topics: Adhesives, Fracture (Materials), Fracture (Process), Particulate matter, Synthetic diamonds, Chemical vapor deposition, Diamond films, Nucleation (Physics), Stress, Electronics
Journal Articles

A Model Study of Thermal Stress-Induced Voiding in Electronic Packages

Y. Huang, K. X. Hu, C. P. Yeh, N.-Y. Li, K. C. Hwang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 229–234.
https://doi.org/10.1115/1.2792157
Published Online: December 1, 1996
View Article titled, A Model Study of Thermal Stress-Induced Voiding in Electronic Packages
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Topics: Electronic packages, Stress, Cavitation, Solids, Adhesives, Design, Failure mechanisms, Hardening, Hydrostatics, Integrated circuits
Journal Articles

Undercooling of 63SN-37PB Solder Pastes

Zequn Mei
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 105–108.
https://doi.org/10.1115/1.2792075
Published Online: June 1, 1995
View Article titled, Undercooling of 63SN-37PB Solder Pastes
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Topics: Solders, Supercooling, Aluminum, Cooling, Copper, Solidification, Wetting, Manufacturing, Nucleation (Physics), Solder joints
Journal Articles

Observations on the Mechanisms of Fatigue in Eutectic Pb-Sn Solder Joints

D. Tribula, D. Grivas, D. R. Frear, J. W. Morris, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1989, 111(2): 83–89.
https://doi.org/10.1115/1.3226526
Published Online: June 1, 1989
View Article titled, Observations on the Mechanisms of Fatigue in Eutectic Pb-Sn Solder Joints
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Topics: Fatigue, Solder joints, Tin, Shear (Mechanics), Creep, Recrystallization, Solders, Deformation, Failure, Fatigue cracks