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Journal Articles

Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach

Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041106.
https://doi.org/10.1115/1.2993126
Published Online: November 14, 2008
View Article titled, Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach
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Topics: Copper, Flow (Dynamics), Heat, Heat conduction, Insulation, Laminates, Modeling, Printed circuit boards, Resins, Temperature
Journal Articles

The Impact of Interfacial Adhesion on PTH and Via Stress State

G. Subbarayan, K. Ramakrishna, B. G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 260–267.
https://doi.org/10.1115/1.2792247
Published Online: December 1, 1997
View Article titled, The Impact of Interfacial Adhesion on PTH and Via Stress State
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Topics: Adhesion, Stress, Laminates, Fracture (Materials), Fracture (Process), Plating, Drills (Tools), Finite element analysis, Junctions, Manufacturing
Journal Articles

Simulation of the Influence of Manufacturing Quality on Reliability of Vias

A. Dasgupta, V. Ramappan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 141–146.
https://doi.org/10.1115/1.2792081
Published Online: June 1, 1995
View Article titled, Simulation of the Influence of Manufacturing Quality on Reliability of Vias
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Topics: Manufacturing, Reliability, Simulation, Plating, Buckling, Cycles, Design, Design engineering, Electronic packages, Failure
Journal Articles

An Experimental Investigation of Deformation of Plated Holes for a Single 30-210-30°C Thermal Cycle

T. S. Gross, J. A. Perault, D. W. Watt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 1–5.
https://doi.org/10.1115/1.2905488
Published Online: March 1, 1994
View Article titled, An Experimental Investigation of Deformation of Plated Holes for a Single 30-210-30°C Thermal Cycle
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Topics: Cycles, Deformation, Temperature, Stress, Elastic analysis, Finite element model, Laminates, Compression, Deflection, Displacement
Journal Articles

Indentation Method to Measure Plating Ductility

P. A. Engel, D. L. Questad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1990, 112(3): 272–277.
https://doi.org/10.1115/1.2904378
Published Online: September 1, 1990
View Article titled, Indentation Method to Measure Plating Ductility
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Topics: Ductility, Plating, Fracture (Materials), Displacement, Durability, Electron microscopy, X-rays