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Journal Articles

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Sushil Doranga, Dongji Xie, Jeffrey Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov

J. Electron. Packag. September 2023, 145(3): 031007.

Paper No: EP-22-1070

DOI: https://doi.org/10.1115/1.4056886

Published Online: March 7, 2023

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Topics: Excitation, Fatigue life, Fatigue testing, Finite element analysis, Finite element model, Modeling, Resonance, Simulation, Solder joints, Stress

Journal Articles

Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches

Xin Wei, Sa'd Hamasha, Ali Alahmer, Mohamed El Amine Belhadi

J. Electron. Packag. September 2023, 145(3): 031005.

Paper No: EP-22-1066

DOI: https://doi.org/10.1115/1.4056559

Published Online: January 27, 2023

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Topics: Ball-Grid-Array packaging, Cycles, Fatigue, Finishes, Solder joints, Stress, Fatigue life, Solders, Alloys

Journal Articles

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler

J. Electron. Packag. March 2023, 145(1): 011107.

Paper No: EP-22-1020

DOI: https://doi.org/10.1115/1.4056445

Published Online: December 23, 2022

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Topics: Design, Reliability, Simulation, Thermomechanics, Manufacturing, Solders, Computer simulation, Creep, Stress, Cycles

Journal Articles

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer

J. C. C. Lo, Q. Jiang, X. Qiu, N. Tu

J. Electron. Packag. March 2023, 145(1): 011103.

Paper No: EP-22-1013

DOI: https://doi.org/10.1115/1.4055840

Published Online: October 22, 2022

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Topics: High temperature, Inks, Reliability, Shear (Mechanics), Sintering, Storage, Solders, Additive manufacturing, Solder joints

Journal Articles

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Xin Wei, Mohamed El Amine Belhadi, Sa'd Hamasha, Ali Alahmer, Rong Zhao, Bart Prorok, A. R. Nazmus Sakib

J. Electron. Packag. June 2023, 145(2): 021007.

Paper No: EP-22-1044

DOI: https://doi.org/10.1115/1.4055318

Published Online: September 28, 2022

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Topics: Alloys, Fatigue, Shear (Mechanics), Shear strength, Solders, Tin, Stress, Solder joints, Fatigue testing, Fatigue life

Journal Articles

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Mahsa Montazeri, Whit M. Vinson, David R. Huitink

J. Electron. Packag. June 2023, 145(2): 021002.

Paper No: EP-22-1037

DOI: https://doi.org/10.1115/1.4055024

Published Online: August 8, 2022

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Topics: Electrodiffusion, Failure, Solder joints, Solders, Stress, Temperature, Tension, Testing, Current density, Tin

Journal Articles

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Abel Misrak, Rabin Bhandari, Dereje Agonafer

J. Electron. Packag. March 2023, 145(1): 011204.

Paper No: EP-21-1110

DOI: https://doi.org/10.1115/1.4054784

Published Online: August 3, 2022

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Topics: Glass transition, Reliability, Semiconductor wafers, Storage, Stress, Temperature, Testing, Viscoelasticity, Solders, Failure

Journal Articles

The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods

Yuqian Xu, Qiwen Zeng, Yuexing Wang, Mingyong Wu, Xiangyu Chen, Gang Chen

J. Electron. Packag. March 2023, 145(1): 011205.

Paper No: EP-22-1001

DOI: https://doi.org/10.1115/1.4054821

Published Online: August 3, 2022

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Topics: Algebra, Deformation, Differential equations, Genetic algorithms, Stress, Errors, Solders

Journal Articles

Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation

Zuraihana Bachok, Mohamad Aizat Abas, Muhammad Zaim Hanif Nazarudin, Saifulmajdy A. Zahiri, Mohamad Fikri Mohd Sharif, Fakhrozi Che Ani

J. Electron. Packag. December 2022, 144(4): 041018.

Paper No: EP-21-1157

DOI: https://doi.org/10.1115/1.4054132

Published Online: April 22, 2022

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Topics: Lasers, Soldering, Solders

Journal Articles

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Ved Prakash Sharma, Naresh Varma Datla

J. Electron. Packag. December 2022, 144(4): 041016.

Paper No: EP-21-1159

DOI: https://doi.org/10.1115/1.4054096

Published Online: March 31, 2022

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Topics: Fracture (Materials), Fracture (Process), Intermetallic compounds, Solder joints, Solders, Tin, Reliability, Fractography, Lead-free solders, Failure

Journal Articles

Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

J. Electron. Packag. June 2022, 144(2): 021116.

Paper No: EP-21-1062

DOI: https://doi.org/10.1115/1.4053764

Published Online: March 11, 2022

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Topics: Solders, Stress-strain curves, Temperature, Alloys, Operating temperature, Tensile strength, Materials properties

Journal Articles

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Junjie Dai, Yuexin Zhang, Zhankun Li, Mingming Chen, Yuhua Guo, Zhekun Fan, Junhui Li

J. Electron. Packag. September 2022, 144(3): 031014.

Paper No: EP-21-1121

DOI: https://doi.org/10.1115/1.4053889

Published Online: March 8, 2022

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Topics: Columns (Structural), Copper, Current density, Flip-chip devices, Solder joints, Solders, Temperature, Tin, Joules, Reliability

Journal Articles

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis

J. Electron. Packag. June 2022, 144(2): 021113.

Paper No: EP-21-1059

DOI: https://doi.org/10.1115/1.4052715

Published Online: January 4, 2022

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Topics: Flip-chip, Glass transition, High temperature, Mechanical properties, Oxidation, Solders, Storage, Temperature, Viscoelasticity, Optical microscopes

Journal Articles

Influence of Laser Soldering Temperatures on Through-Hole Component

Saifulmajdy A. Zahiri, Aizat Abas, M. F. M. Sharif, Fakhrozi Che Ani

J. Electron. Packag. December 2022, 144(4): 041006.

Paper No: EP-21-1075

DOI: https://doi.org/10.1115/1.4052175

Published Online: November 22, 2021

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Topics: Flow (Dynamics), Lasers, Soldering, Solders, Temperature, Lead-free solders, Finite volume methods, Pressure

Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang

J. Electron. Packag. December 2022, 144(4): 041003.

Paper No: EP-20-1094

DOI: https://doi.org/10.1115/1.4052275

Published Online: November 22, 2021

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Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging

Journal Articles

High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

J. Electron. Packag. June 2022, 144(2): 021108.

Paper No: EP-21-1060

DOI: https://doi.org/10.1115/1.4052073

Published Online: October 6, 2021

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Topics: Elastic moduli, Mechanical properties, Solders, Stress, Stress-strain curves, Temperature, Tensile strength, Testing, Operating temperature, High temperature

Journal Articles

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka

J. Electron. Packag. June 2022, 144(2): 021106.

Paper No: EP-21-1010

DOI: https://doi.org/10.1115/1.4052070

Published Online: October 6, 2021

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Topics: Failure, Fatigue, Printed circuit boards, Resistors, Simulation, Solder joints, Solders, Stress, Thermomechanics, Warping

Journal Articles

Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

H. T. Lee, C. Y. Ho, C. C. Lee

J. Electron. Packag. December 2022, 144(4): 041001.

Paper No: EP-21-1043

DOI: https://doi.org/10.1115/1.4052075

Published Online: October 6, 2021

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Topics: Fatigue, Solders, Tin, Displacement, Fracture (Materials), Intermetallic compounds, Packaging, Reliability, Temperature

Journal Articles

A Hybrid Antenna in Package Solution Using FOWLP Technology

Xuesong Zhang, Qian Wang, Bo Wang, Gang Wang, Xin Gu, Yu Chen, Lin Tan, Shengjuan Zhou, Jian Cai

J. Electron. Packag. September 2022, 144(3): 031005.

Paper No: EP-21-1024

DOI: https://doi.org/10.1115/1.4051379

Published Online: September 15, 2021

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Topics: Design, Manufacturing, Millimeter waves, Semiconductor wafers, Warping, Waveguides, Solders, Temperature, Molding

Journal Articles

Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints

Abhishek Deshpande, Qian Jiang, Abhijit Dasgupta, Ulrich Becker

J. Electron. Packag. September 2022, 144(3): 031006.

Paper No: EP-21-1025

DOI: https://doi.org/10.1115/1.4051647

Published Online: September 15, 2021

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Topics: Damage, Durability, Fatigue, Shear (Mechanics), Solder joints, Solders, Stress, Finite element analysis, Fatigue damage, Hydrostatics

Journal citation

NARROW

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods

Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

Influence of Laser Soldering Temperatures on Through-Hole Component

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

A Hybrid Antenna in Package Solution Using FOWLP Technology

Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints

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