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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041115.
Paper No: EP-24-1015
Published Online: August 17, 2024
Journal Articles
Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021114.
Paper No: EP-21-1052
Published Online: February 7, 2022
Journal Articles
Palash V. Acharya, Manojkumar Lokanathan, Abdelhamid Ouroua, Robert Hebner, Shannon Strank, Vaibhav Bahadur
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041109.
Paper No: EP-21-1087
Published Online: November 5, 2021
Topics:
Algorithms,
Artificial neural networks,
Bridges (Structures),
Cooling,
Heat sinks,
Junctions,
Machine learning,
Machinery,
Simulation,
Steady state
Includes: Supplementary data
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
Published Online: September 24, 2021
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021104.
Paper No: EP-20-1142
Published Online: September 24, 2021
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031007.
Paper No: EP-21-1039
Published Online: September 15, 2021
Journal Articles
Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Nazli Donmezer, Ashutosh Giri, Patrick E. Hopkins, Sukwon Choi, Darshan Pahinkar, Jingjing Shi, Samuel Graham, Zhiting Tian, Laura Ruppalt
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020804.
Paper No: EP-20-1070
Published Online: February 22, 2021
Journal Articles
Jerzy Szałapak, Konrad Kiełbasiński, Łucja Dybowska-Sarapuk, Jakub Krzeminski, Marian Teodorczyk, Tomasz Kowaluk, Małgorzata Jakubowska
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2021, 143(3): 034501.
Paper No: EP-20-1091
Published Online: January 19, 2021
Journal Articles
Yiwen Song, James Spencer Lundh, Weijie Wang, Jacob H. Leach, Devon Eichfeld, Anusha Krishnan, Carlos Perez, Dong Ji, Trent Borman, Kevin Ferri, Jon-Paul Maria, Srabanti Chowdhury, Jae-Hyun Ryou, Brian M. Foley, Sukwon Choi
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041112.
Paper No: EP-20-1014
Published Online: July 10, 2020
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2021, 143(1): 010801.
Paper No: EP-20-1051
Published Online: June 29, 2020
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031114.
Paper No: EP-19-1110
Published Online: June 8, 2020
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031109.
Paper No: EP-20-1009
Published Online: May 4, 2020
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031106.
Paper No: EP-19-1098
Published Online: April 24, 2020
Journal Articles
Yuejin Wang, Guozhen Liu, Shiqiang Lu, Bin Guo, Hongye Zhang, Fuchun Xu, Xiaohong Chen, Duanjun Cai, Junyong Kang
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031103.
Paper No: EP-19-1121
Published Online: April 17, 2020
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021012.
Paper No: EP-19-1087
Published Online: April 6, 2020
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011011.
Paper No: EP-19-1064
Published Online: November 8, 2019
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040803.
Paper No: EP-18-1067
Published Online: July 30, 2019
Journal Articles
Seung Kyu Oh, James Spencer Lundh, Shahab Shervin, Bikramjit Chatterjee, Dong Kyu Lee, Sukwon Choi, Joon Seop Kwak, Jae-Hyun Ryou
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2019, 141(2): 020801.
Paper No: EP-18-1026
Published Online: February 25, 2019
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011002.
Paper No: EP-18-1029
Published Online: February 25, 2019
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011001.
Paper No: EP-18-1021
Published Online: February 25, 2019
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