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Journal Articles

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for GaN HEMTs

Han-ling Li, Yang Shen, Yu-Chao Hua, S.L. Sobolev, Bing-Yang Cao

J. Electron. Packag.

Paper No: EP-22-1007

DOI: https://doi.org/10.1115/1.4054698

Published Online: June 1, 2022

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Topics: Diffusion (Physics), Gallium nitride, Heating, Modeling, Phonons, Temperature, Heat, Simulation, Heat conduction, Electromagnetic scattering

Journal Articles

Special Issue on InterPACK2020

Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar

J. Electron. Packag. June 2022, 144(2): 020301.

Paper No: EP-21-1158

DOI: https://doi.org/10.1115/1.4053122

Published Online: January 4, 2022

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Topics: Additive manufacturing, Cloud computing, Computers, Data centers, Electric vehicles, Electronic packaging, Electronics, Engineering teachers, Microelectronic packaging, Modeling

Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome

J. Electron. Packag. June 2022, 144(2): 021110.

Paper No: EP-21-1048

DOI: https://doi.org/10.1115/1.4052767

Published Online: November 22, 2021

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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities

Journal Articles

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Justin Hollis, Darin J. Sharar, Todd Bandhauer

J. Electron. Packag. December 2021, 143(4): 041111.

Paper No: EP-21-1103

DOI: https://doi.org/10.1115/1.4052669

Published Online: November 5, 2021

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Topics: Copper, Cycles, Junctions, Phase change materials, Temperature, Heat, Composite materials, Transients (Dynamics), Thermal management, Cities

Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock

J. Electron. Packag. June 2022, 144(2): 021105.

Paper No: EP-21-1012

DOI: https://doi.org/10.1115/1.4052071

Published Online: September 24, 2021

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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat

Journal Articles

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Gilberto Moreno, Sreekant Narumanchi, Xuhui Feng, Paul Anschel, Steve Myers, Phil Keller

J. Electron. Packag. March 2022, 144(1): 011004.

Paper No: EP-20-1093

DOI: https://doi.org/10.1115/1.4049815

Published Online: August 6, 2021

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Topics: Cooling, Electronics, Fluids, Heat exchangers, Heat transfer, Thermal management, Thermal resistance, Vehicles, Heat, Temperature

Journal Articles

A Review on Transient Thermal Management of Electronic Devices

John Mathew, Shankar Krishnan

J. Electron. Packag. March 2022, 144(1): 010801.

Paper No: EP-20-1113

DOI: https://doi.org/10.1115/1.4050002

Published Online: August 6, 2021

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Topics: Cooling, Heat, Heat pipes, Phase change materials, Temperature, Thermal management, Transients (Dynamics), Vapors, Boiling, Steady state

Journal Articles

Modular Heat Sinks for Enhanced Thermal Management of Electronics

Muhammad Jahidul Hoque, Alperen Günay, Andrew Stillwell, Yashraj Gurumukhi, Robert C. N. Pilawa-Podgurski, Nenad Miljkovic

J. Electron. Packag. June 2021, 143(2): 020903.

Paper No: EP-20-1081

DOI: https://doi.org/10.1115/1.4049294

Published Online: February 22, 2021

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Topics: Electronics, Gallium nitride, Heat sinks, Thermal management, Power density, Design, Temperature, Power converters, Manufacturing

Journal Articles

Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization

Reece Whitt, Skyler Hudson, David Huitink, Zhao Yuan, Asif Emon, Fang Luo

J. Electron. Packag. December 2020, 142(4): 041004.

Paper No: EP-20-1034

DOI: https://doi.org/10.1115/1.4048493

Published Online: October 12, 2020

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Topics: Additive manufacturing, Coolants, Cooling, Design, Electromagnetic interference, Flat heat pipes, Flow (Dynamics), Fluids, Heat, Heat transfer

Journal Articles

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

Jae Choon Kim, Zongqing Ren, Anil Yuksel, Ercan M. Dede, Prabhakar R. Bandaru, Dan Oh, Jaeho Lee

J. Electron. Packag. March 2021, 143(1): 010801.

Paper No: EP-20-1051

DOI: https://doi.org/10.1115/1.4047414

Published Online: June 29, 2020

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Topics: Heat, Metamaterials, Thermal management, Cooling, Temperature, Thermal conductivity, Electronic packaging, Design, Packaging, Anisotropy

Journal Articles

A System to Package Perspective on Transient Thermal Management of Electronics

H. Peter de Bock, David Huitink, Patrick Shamberger, James Spencer Lundh, Sukwon Choi, Nicholas Niedbalski, Lauren Boteler

J. Electron. Packag. December 2020, 142(4): 041111.

Paper No: EP-20-1028

DOI: https://doi.org/10.1115/1.4047474

Published Online: June 29, 2020

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Topics: Transients (Dynamics), Thermal management, Design, Phase change materials, Temperature, Heat

Journal Articles

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials

Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, David Huitink

J. Electron. Packag. December 2020, 142(4): 041108.

Paper No: EP-20-1019

DOI: https://doi.org/10.1115/1.4047497

Published Online: June 26, 2020

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Topics: Cooling, Electronics, Heat, Phase change materials, Reliability, Temperature, Thermal management, Heat sinks, Design, Convection

Journal Articles

Embedded Cooling for Wide Bandgap Power Amplifiers: A Review

A. Bar-Cohen, J. J. Maurer, D. H. Altman

J. Electron. Packag. December 2019, 141(4): 040803.

Paper No: EP-18-1067

DOI: https://doi.org/10.1115/1.4043404

Published Online: July 30, 2019

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Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Transistors, Thermal conductivity, Temperature, Junctions, Heat, Thermal management

Journal Articles

Special Issue on InterPACK 2018

Ercan M. Dede, Lauren Boteler, Changqing Chen, Przemyslaw Jakub Gromala, Benjamin Leever, Wei Li

J. Electron. Packag. September 2019, 141(3): 030301.

Paper No: EP-19-1036

DOI: https://doi.org/10.1115/1.4043484

Published Online: May 8, 2019

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Topics: Electronic packaging, Electronics, Microelectromechanical systems, Design, Internet of things, Condition monitoring, Data centers, Electric vehicles, Energy conversion, Engineering teachers

Journal Articles

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Seung Kyu Oh, James Spencer Lundh, Shahab Shervin, Bikramjit Chatterjee, Dong Kyu Lee, Sukwon Choi, Joon Seop Kwak, Jae-Hyun Ryou

J. Electron. Packag. June 2019, 141(2): 020801.

Paper No: EP-18-1026

DOI: https://doi.org/10.1115/1.4041813

Published Online: February 25, 2019

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Topics: Energy gap, Gallium nitride, Light-emitting diodes, Photonic equipment, Semiconductors (Materials), Temperature, Temperature measurement, Thermal management, Thermography, Automotive industry

Journal Articles

Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

Mohamed H. Nasr, Craig E. Green, Peter A. Kottke, Xuchen Zhang, Thomas E. Sarvey, Yogendra K. Joshi, Muhannad S. Bakir, Andrei G. Fedorov

J. Electron. Packag. March 2017, 139(1): 011006.

Paper No: EP-16-1097

DOI: https://doi.org/10.1115/1.4035387

Published Online: January 5, 2017

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Topics: Boiling, Flow (Dynamics), Flux (Metallurgy), Heat, Thermal resistance, Heat flux, Wall temperature, Coolants, Pressure drop, Thermal management

Journal Articles

Modeling and Analysis for Thermal Management in Gallium Nitride HEMTs Using Microfluidic Cooling

Gunjan Agarwal, Thomas Kazior, Thomas Kenny, Dana Weinstein

J. Electron. Packag. March 2017, 139(1): 011001.

Paper No: EP-16-1073

DOI: https://doi.org/10.1115/1.4035064

Published Online: November 10, 2016

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Topics: Cooling, Flow (Dynamics), Fluids, Gallium nitride, Microchannels, Microfluidics, Silicon, Temperature, Heat, Geometry

Journal Articles

Benchmarking Study on the Thermal Management Landscape for Three-Dimensional Integrated Circuits: From Back-Side to Volumetric Heat Removal

Thomas Brunschwiler, Arvind Sridhar, Chin Lee Ong, Gerd Schlottig

J. Electron. Packag. March 2016, 138(1): 010911.

Paper No: EP-15-1093

DOI: https://doi.org/10.1115/1.4032492

Published Online: March 10, 2016

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Topics: Cooling, Fluids, Heat, Thermal management, Silicon, Microchannels

Journal Articles

A Brief Overview of Recent Developments in Thermal Management in Data Centers

Sami Alkharabsheh, John Fernandes, Betsegaw Gebrehiwot, Dereje Agonafer, Kanad Ghose, Alfonso Ortega, Yogendra Joshi, Bahgat Sammakia

J. Electron. Packag. December 2015, 137(4): 040801.

Paper No: EP-14-1117

DOI: https://doi.org/10.1115/1.4031326

Published Online: September 10, 2015

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Topics: Computational fluid dynamics, Cooling, Data centers, Modeling, Temperature, Tiles, Thermal management

Journal Articles

Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced Microgap

Xuefei Han, Yogendra K. Joshi

J. Electron. Packag. March 2015, 137(1): 011008.

Paper No: EP-13-1083

DOI: https://doi.org/10.1115/1.4028574

Published Online: October 15, 2014

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Topics: Computational fluid dynamics, Control equipment, Flow (Dynamics), Fluids, Heat, Modeling, Temperature, Thermal management, Microfluidics

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Journal citation

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Manuscript

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for GaN HEMTs

Special Issue on InterPACK2020

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

A Review on Transient Thermal Management of Electronic Devices

Modular Heat Sinks for Enhanced Thermal Management of Electronics

Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

A System to Package Perspective on Transient Thermal Management of Electronics

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials

Embedded Cooling for Wide Bandgap Power Amplifiers: A Review

Special Issue on InterPACK 2018

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

Modeling and Analysis for Thermal Management in Gallium Nitride HEMTs Using Microfluidic Cooling

Benchmarking Study on the Thermal Management Landscape for Three-Dimensional Integrated Circuits: From Back-Side to Volumetric Heat Removal

A Brief Overview of Recent Developments in Thermal Management in Data Centers

Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced Microgap

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