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Journal Articles

Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology

Pradeep Lall, Kartik Goyal, Scott Miller

J. Electron. Packag. June 2022, 144(2): 021119.

Paper No: EP-21-1057

DOI: https://doi.org/10.1115/1.4054131

Published Online: April 22, 2022

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Topics: Aerosols, Sintering, Metals, Inks, Stress, Shear (Mechanics), Failure, Design, Temperature

Journal Articles

Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

Shiva Farzinazar, Zongqing Ren, Jungyun Lim, Jae Choon Kim, Jaeho Lee

J. Electron. Packag. June 2022, 144(2): 021118.

Paper No: EP-21-1038

DOI: https://doi.org/10.1115/1.4053948

Published Online: March 28, 2022

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Topics: Heat, Optimization, Thermomechanics, Topology, Design, Electronic packaging, Heat sinks

Journal Articles

Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller

J. Electron. Packag. June 2022, 144(2): 021117.

Paper No: EP-21-1066

DOI: https://doi.org/10.1115/1.4053766

Published Online: March 11, 2022

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Topics: Aerosols, Failure, Inks, Printing, Shear (Mechanics), Sintering, Stress, Vehicles, Temperature, Silver

Journal Articles

Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

J. Electron. Packag. June 2022, 144(2): 021116.

Paper No: EP-21-1062

DOI: https://doi.org/10.1115/1.4053764

Published Online: March 11, 2022

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Topics: Solders, Stress-strain curves, Temperature, Alloys, Operating temperature, Tensile strength, Materials properties

Journal Articles

High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors

Alexis Krone, Josh Kasitz, David Huitink, Hannah Alpert, Debbie G. Senesky, Satish Shetty, Gregory Salamo

J. Electron. Packag. June 2022, 144(2): 021115.

Paper No: EP-21-1064

DOI: https://doi.org/10.1115/1.4053765

Published Online: March 7, 2022

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Topics: Gallium, Gallium nitride, Hall effect, High temperature, Sensors, Temperature, Alloys, Reliability

Journal Articles

Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model

Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi

J. Electron. Packag. June 2022, 144(2): 021114.

Paper No: EP-21-1052

DOI: https://doi.org/10.1115/1.4053121

Published Online: February 7, 2022

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Topics: Engines, Finite element analysis, Lamination, Motors, Stators, Temperature, Thermal conductivity, Winding (process), Sensitivity analysis, Contact resistance

Journal Articles

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis

J. Electron. Packag. June 2022, 144(2): 021113.

Paper No: EP-21-1059

DOI: https://doi.org/10.1115/1.4052715

Published Online: January 4, 2022

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Topics: Flip-chip, Glass transition, High temperature, Mechanical properties, Oxidation, Solders, Storage, Temperature, Viscoelasticity, Optical microscopes

Journal Articles

Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures

Pradeep Lall, Ved Soni, Scott Miller

J. Electron. Packag. June 2022, 144(2): 021112.

Paper No: EP-21-1058

DOI: https://doi.org/10.1115/1.4052750

Published Online: January 4, 2022

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Topics: Batteries, Cycles, Lithium-ion batteries, Temperature, Regression models, Operating temperature, Reliability

Journal Articles

Remaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads

Pradeep Lall, Tony Thomas, Ken Blecker

J. Electron. Packag. June 2022, 144(2): 021111.

Paper No: EP-21-1067

DOI: https://doi.org/10.1115/1.4052630

Published Online: December 1, 2021

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Topics: Failure, Service life (Equipment), Signals, Temperature, Vibration, Principal component analysis

Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome

J. Electron. Packag. June 2022, 144(2): 021110.

Paper No: EP-21-1048

DOI: https://doi.org/10.1115/1.4052767

Published Online: November 22, 2021

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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities

Journal Articles

Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces

Zhenyu She, Vijay K. Dhir

J. Electron. Packag. December 2021, 143(4): 041113.

Paper No: EP-21-1108

DOI: https://doi.org/10.1115/1.4052716

Published Online: November 9, 2021

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Topics: Critical heat flux, Disks, Vapors, Vessels, Boiling, Wavelength, Pool boiling

Journal Articles

Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

Cheng-Hui Lin, Yoonjin Won

J. Electron. Packag. December 2021, 143(4): 041112.

Paper No: EP-21-1105

DOI: https://doi.org/10.1115/1.4052790

Published Online: November 9, 2021

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Topics: Boiling, Bubbles, Critical heat flux, Electrodeposition, Heat transfer, Copper, Dynamics (Mechanics), Microscale devices, Fins, Flow (Dynamics)

Includes: Supplementary data

Journal Articles

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Justin Hollis, Darin J. Sharar, Todd Bandhauer

J. Electron. Packag. December 2021, 143(4): 041111.

Paper No: EP-21-1103

DOI: https://doi.org/10.1115/1.4052669

Published Online: November 5, 2021

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Topics: Copper, Cycles, Junctions, Phase change materials, Temperature, Heat, Composite materials, Transients (Dynamics), Thermal management, Cities

Journal Articles

Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling

Filippo Cataldo, Yuri Carmelo Crea

J. Electron. Packag. December 2021, 143(4): 041110.

Paper No: EP-21-1094

DOI: https://doi.org/10.1115/1.4052670

Published Online: November 5, 2021

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Topics: Condensers (steam plant), Heat, Stress, Flow (Dynamics), Temperature, Fluids, Modeling

Journal Articles

Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Palash V. Acharya, Manojkumar Lokanathan, Abdelhamid Ouroua, Robert Hebner, Shannon Strank, Vaibhav Bahadur

J. Electron. Packag. December 2021, 143(4): 041109.

Paper No: EP-21-1087

DOI: https://doi.org/10.1115/1.4052814

Published Online: November 5, 2021

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Topics: Algorithms, Artificial neural networks, Bridges (Structures), Cooling, Heat sinks, Junctions, Machine learning, Machinery, Simulation, Steady state

Includes: Supplementary data

Journal Articles

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Jimmy Chuang, Jin Yang, David Shia, Y. L. Li

J. Electron. Packag. December 2021, 143(4): 041108.

Paper No: EP-21-1037

DOI: https://doi.org/10.1115/1.4052711

Published Online: November 2, 2021

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Topics: Boiling, Cooling, Electronic packages, Injection molding, Metals, Printing, Additive manufacturing, Flat heat pipes, Manufacturing

Journal Articles

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

Jimil M. Shah, Keerthivasan Padmanaban, Hrishabh Singh, Surya Duraisamy Asokan, Satyam Saini, Dereje Agonafer

J. Electron. Packag. June 2022, 144(2): 021109.

Paper No: EP-21-1016

DOI: https://doi.org/10.1115/1.4052536

Published Online: October 14, 2021

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Topics: Cables, Cooling, Cycles, Fluids, Mineral oil, Printed circuit boards, Reliability, Temperature, Capacitance, Optical cables

Journal Articles

The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling

Ankur Miglani, Anali Soto, Justin A. Weibel, Suresh V. Garimella

J. Electron. Packag. December 2021, 143(4): 041107.

Paper No: EP-21-1114

DOI: https://doi.org/10.1115/1.4052532

Published Online: October 14, 2021

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Topics: Flow (Dynamics), Heating, Microchannels, Boiling

Journal Articles

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Kidus Guye, De Dong, Yunseo Kim, Hyoungsoon Lee, Baris Dogruoz, Damena Agonafer

J. Electron. Packag. December 2021, 143(4): 041106.

Paper No: EP-21-1120

DOI: https://doi.org/10.1115/1.4052465

Published Online: October 13, 2021

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Topics: Design, Drops, Evaporation, Heat conduction, Heat transfer, Heat transfer coefficients, Optimization, Particle swarm optimization, Shapes, Vapors

Journal Articles

High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

J. Electron. Packag. June 2022, 144(2): 021108.

Paper No: EP-21-1060

DOI: https://doi.org/10.1115/1.4052073

Published Online: October 6, 2021

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Topics: Elastic moduli, Mechanical properties, Solders, Stress, Stress-strain curves, Temperature, Tensile strength, Testing, Operating temperature, High temperature

Journal citation

NARROW

Supplemental Material

Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology

Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature

High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors

Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures

Remaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces

Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages

Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling

Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

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