.... 30 07 2013 15 02 2014 In an effort to increase processor speeds, 3D IC architecture is being aggressively pursued by researchers and chip manufacturers. This architecture allows extremely high level of integration with enhanced electrical performance and expanded functionality...

... transfer coefficient along the flow direction is an effective way to enhance the cooling performance while mitigating the temperature nonuniformity and high pressure drop concerns. This investigation evaluates numerically the cooling performance of different flow channel designs suitable in 3D IC...