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Keywords: 3D IC
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Journal Articles
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. June 2014, 136(2): 024001.
Paper No: EP-13-1081
Published Online: April 29, 2014
... Corporation demonstrated a practical implementation of integrated microchannels within a 3D IC stack. They employed fluidic TSVs to deliver liquid to the microchannels. The TSVs for the electrical interconnects were fabricated in the silicon as shown in Fig. 4 . The microchannels were 200  μ m tall and 150...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021007.
Paper No: EP-13-1082
Published Online: April 29, 2014
... pronounced on the transition gaps, after which the flow continues to develop thermally and hydraulically. The observed behaviors for the variable-fin-density configurations help to homogenize the temperature distribution, which is a desired feature for the thermal management of 3D ICs. The objective...