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Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011005.
Paper No: EP-22-1080
Published Online: June 6, 2023
...Ping Sun; Bing-Huan Huang; Kui Li; Liang Gong; Chuan-Yong Zhu; Ying Zheng To solve the thermal management problem in the three-dimensional integrated circuit (3D-IC) with high integration and multilayer, this paper establishes a 3D-IC interlayer microchannel model with various embedded TSV micropin...