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Keywords: Cooling Electronics
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Journal Articles

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate

Alfonso Ortega, Shankar Ramanathan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 235–243.
https://doi.org/10.1115/1.1569507
Published Online: June 10, 2003
... and R. Culham. 26 March 2002 10 06 2003 cooling packaging printed circuit layout forced convection Green's function methods temperature distribution finite element analysis Cooling Electronics Forced Convection Greens Functions Forced air cooling of electronic...
View Article titled, On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate
Open the PDF for On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate in another window
Topics: Cooling, Electrical conductivity, Electronic components, Flow (Dynamics), Forced convection, Heat, Heat conduction, Heat transfer, Temperature, Thermal conductivity
Journal Articles

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources

Alfonso Ortega, Shankar Ramanathan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 226–234.
https://doi.org/10.1115/1.1569506
Published Online: June 10, 2003
... (packaging) Cooling Electronics Forced Convection Thermal Wake Green’s Function In order to predict the probable operating temperature of an electronic device on a board or circuit pack installed in an air-cooled enclosure, it is necessary, first, to predict the probable air flow over...
View Article titled, On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources
Open the PDF for On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part I: Thermal Wake Models for Rectangular Heat Sources in another window
Topics: Cooling, Flow (Dynamics), Heat, Strips, Temperature, Wakes, Electronic components, Turbulence