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Keywords: additive manufacturing
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011103.
Paper No: EP-22-1013
Published Online: October 22, 2022
...J. C. C. Lo; Q. Jiang; X. Qiu; N. Tu Redistribution layer (RDL) is one key enabling technology for advanced packaging. RDL is usually fabricated at wafer level by a photolithography process. An alternative approach for implementing RDL by additive manufacturing (AM) method is proposed in this study...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. March 2020, 142(1): 014501.
Paper No: EP-19-1040
Published Online: September 19, 2019
... into play. Currently, the interposers are mainly made of silicon or glass, which incur huge additional costs to the packaged components. In this study, the unique advantages of additive manufacturing (AM) are exploited to realize organic interposers. The proposed interposers provide easy signal probing...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031004.
Paper No: EP-13-1041
Published Online: September 1, 2015
... Annual Solid Freeform Fabrication Symposium , University of Texas at Austin, Austin, TX, Aug. 14–16, pp. 644 – 655 . http://sffsymposium.engr.utexas.edu/Manuscripts/2006/2006-56-Lopes.pdf [40] Olivas , R. I. , 2011 , “ Conformal Electronics Manufacturing Through Additive Manufacturing...
