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Keywords: analytical modeling
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2013, 135(3): 034501.
Paper No: EP-11-1100
Published Online: June 4, 2013
... analytical modeling Shrinking physical size is a visible trend commonly observed in recent generations of mobile and hand-held electronic products [ 1 ]. Convection of air is constrained in a tightly packed interior of the equipment casing, so that heat conduction is a dominant mode of heat transfer...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041106.
Published Online: November 14, 2008
...Wataru Nakayama An analytical model is developed to estimate the heat transfer performance of printed circuit board (PCBs). The PCB under study is the substrate for a ball-grid-array (BGA) package. Under the BGA, the PCB has a belt of densely populated through-vias that penetrate the laminate...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2006, 128(1): 92–97.
Published Online: May 10, 2005
... interface material that is enhanced with carbon nanotubes. The results from the numerical solution are in excellent agreement with an analytical model ( Desai, A., Geer, J., and Sammakia, B., “Models of Steady Heat Conduction in Multiple Cylindrical Domains,” J. Electron. Packaging (to be published...
