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Keywords: ball grid arrays
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021001.
Published Online: June 22, 2011
... ball grid arrays copper alloys lead alloys printed circuits reflow soldering reliability silver alloys solders thermal stress cracking tin alloys backward compatible mixed solder lead-free thermal cycling A large number of high reliability microelectronics applications...
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011006.
Published Online: March 19, 2010
... of interface delamination between epoxy molding compound and silicon die in the flip chip ball grid array package. 14 02 2009 10 01 2010 19 03 2010 19 03 2010 It has been demonstrated that it is possible to optimize design factors to reduce the risk of underfill delamination between...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031003.
Published Online: June 23, 2009
... as heaters were first designed, fabricated, and calibrated. We next packaged the test chips into low profile, fine pitch ball grid array (LFBGA) packaging with 196 balls and measured the stresses on chip surfaces inside the packaging. After measuring the packaging induced stress as well as the stress under...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021006.
Published Online: April 1, 2009
... to measure the warpage of PWBs/PWBAs/chip packages during convective reflow processes. In this paper, the characteristics of the projection moiré warpage measurement system will be described. In addition, the system will be used to measure the warpage of a PWB and plastic ball grid array packages during...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011008.
Published Online: February 13, 2009
... of Packaging and Assembly Technology ,” IEEE Trans. Compon., Hybrids, Manuf. Technol. 0148-6411 , 16 ( 8 ), pp. 949 – 960 . Lau , J. H. , 1995 , Ball Grid Array Technology , McGraw-Hill , New York . Darveaux , R. , 1997 , “ Solder Joint Fatigue Life Model ,” TMS Annual Meeting...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011001.
Published Online: February 11, 2009
... with fatigue reliability of a thin-profile fine-pitch ball grid array chip-scale package subjected to power cycling. The numerical model was calibrated using steady-state and power cycling experiments. Following the calibrated numerical model, different power cycling durations on the thermal characteristics...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041004.
Published Online: November 17, 2008
... field condition. In this work, the comparative study of PC and ATC was conducted for the reliability of board level interconnects. The comparison was made using both ceramic and organic flip chip ball grid array packages. Moiré interferometry was adopted for the experimental stress analysis. In PC...
Journal Articles
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041106.
Published Online: November 14, 2008
...Wataru Nakayama An analytical model is developed to estimate the heat transfer performance of printed circuit board (PCBs). The PCB under study is the substrate for a ball-grid-array (BGA) package. Under the BGA, the PCB has a belt of densely populated through-vias that penetrate the laminate...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021010.
Published Online: May 15, 2008
...Yan Zhang; Johan Liu; Ragnar Larsson A plastic ball grid array component interconnect has been experimentally investigated and modeled on the basis of micropolar theory. The experimental results were analyzed, and the data also provided the verification for the micropolar interface model. Two...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011012.
Published Online: February 14, 2008
... and are summarized in the following sections. 04 12 2006 30 07 2007 14 02 2008 ball grid arrays ceramics integrated circuit manufacture solders vibrations The low-cycle fatigue failure of solder joints due to coefficient of thermal expansion (CTE) mismatch is fairly well...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 373–381.
Published Online: March 25, 2007
... to capture the deformation kinematics. Component types examined include plastic ball-grid arrays, tape-array ball-grid array, quad-flat-no-lead package, and conduction-cooled ball-grid array. Model predictions have been correlated with experimental data. Impact of experimental error sources on model...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 382–390.
Published Online: March 7, 2007
.... Previous studies on electronic reliability for automotive environments have addressed the damage mechanics of solder joints in plastic ball-grid arrays on non-metal-backed substrates ( Lall et al., 2003, “Model for BGA and CSP in Automotive Underhood Environments,” Electronic Components and Technology...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 427–433.
Published Online: February 13, 2007
... in finite-element simulations. The developed technique has been used to determine the thermomechanical reliability of organic and ceramic ball grid array packages, and it is shown that the number of cycles determined by the proposed technique is comparable to the number of cycles determined through...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 273–277.
Published Online: September 8, 2006
... 2006 08 09 2006 ball grid arrays durability finite element analysis reliability solders voids (solid) Voids are one of the major categories of manufacturing defects in solder joints of electronic assemblies that can potentially degrade the reliability of interconnects. Voids can...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 149–156.
Published Online: August 14, 2006
... aging showed significance within the first 100 h. I – V characteristics of the daisy chained ball grid array devices assembled with and without bumps revealed considerable difference in the breakdown current. The correlation between initial contact resistance of the daisy chain and the final breakdown...