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Keywords: board-level drop test
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2007, 129(1): 105–108.
Published Online: June 6, 2006
..., the package with smaller solder joints and a smaller joint pitch suffers a greater drop reliability concern. 22 01 2006 06 06 2006 chip scale packaging circuit reliability solders mechanical testing transient analysis printed circuit testing board-level drop test WLCSP...