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Keywords: design for environmentClose
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 195–201.
Published Online: July 8, 2004
.... Associate Editor: G.-Q. Lu. 01 July 2003 08 07 2004 packaging design for environment environmental degradation dielectric losses Young's modulus bending thermal expansion finite element analysis permittivity reliability The LCP has very attractive properties that include...