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Journal Articles

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

Fei Chong Ng, Mohamad Aizat Abas
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041009.
Paper No: EP-21-1137
DOI: https://doi.org/10.1115/1.4052920
Published Online: December 1, 2021
...Fei Chong Ng; Mohamad Aizat Abas Recent advances in the micro-electronics industry have increased the demand for smaller and more compact package devices with higher performance. This paper presents an analytical multiparametric design optimization approach for the miniaturization of flip-chip...
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Topics: Design, Flip-chip packages, Flow (Dynamics), Optimization, Fluids, Computer simulation
Journal Articles

Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment

Tunc Icoz, Nitin Verma, Yogesh Jaluria
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 466–478.
DOI: https://doi.org/10.1115/1.2353284
Published Online: March 27, 2006
... and experiment design optimization channel flow B bottom plate thickness C h s surface length of the heat sources exposed to convection d separation distance d ¯ normalized separation distance ∊ [0,1] e uncertainty...
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Topics: Cooling, Design, Flow (Dynamics), Heat, Heat transfer, Optimization, Simulation, Computer simulation, Pressure drop, Cooling systems
Journal Articles

A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks

Hamid Hadim, Tohru Suwa
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 306–313.
DOI: https://doi.org/10.1115/1.1997161
Published Online: November 16, 2004
... , 7 ( 4 ), pp. 319 – 336 . 20 10 2003 16 11 2004 ball grid arrays thermal management (packaging) neural nets optimisation Multidisciplinary Design Electronics Packaging Neural Networks Design Optimization Ball Grid Array Current trends in electronics...
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Topics: Artificial neural networks, Design, Optimization, Ball-Grid-Array packaging, Ball-Grid-Array packages, Solders