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Keywords: digital image correlation
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Journal Articles

Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films

Ian Chin, Wei Keat Loh, Seow Chien Kee, Yi He, Mohd. Zulkifly Abdullah, Masahiro Tsuriya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011009.
Paper No: EP-23-1055
https://doi.org/10.1115/1.4066083
Published Online: August 24, 2024
... maintains specimens in a saturated state using a high-pressure enclosure, while digital image correlation (DIC) was used to measure in situ strain change in the specimen due to hygrothermal expansion. Hygroscopic swelling strain is obtained by removing the thermal strain component. This enables swelling...
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Topics: Absorption, Epoxy resins, High temperature, Temperature, Thermal expansion
Journal Articles

An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages

Sushma Madduri, William Infantolino, Bahgat.G Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011007.
https://doi.org/10.1115/1.4005911
Published Online: March 19, 2012
.... Packag. Technol., 27 (4), pp. 40–44), and digital image correlation (DIC) (Park and Zhang, 2007, “Investigation of Hygroscopic swelling of Polymers in Freezing Temperature,” ASME International Mechanical Engineering Congress and Exposition). Some of these studies recommended investigation of improved...
View Article titled, An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages
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Topics: Epoxy adhesives, Epoxy resins, Temperature, Temperature effects, Stress analysis (Engineering)