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Keywords: dissolution of Ni and NiP layers
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 365–369.
Published Online: December 22, 2004
... compounds tin alloys silver alloys electrochemical machining dissolving dissolution of Ni and NiP layers lead-free solder intermetallic compounds Soldering is the most important method for joining components in electronics. Every component has at least two contacts to be joined...