... for Electronics Cooling ,” 2015 31st Thermal Measurement, Modeling & Management Symposium ( SEMI-THERM ), San Jose, CA, Mar. 15–19, pp. 60 – 67 . 10.1109/SEMITHERM.2015.7100141 [35] Solovitz , S. A. , and Mainka , J. , 2011 , “ Manifold Design for Micro-Channel Cooling With Uniform Flow...

... for electronics cooling, the overall heat removal capability is evaluated at a T p of 90 °C. Here three subcooling temperatures are considered with the IHS thickness varying from 1 mm to 6 mm. Figure 11 shows the power that can be removed at a T p of 90 °C. As can be seen from...

... integrated heat spreader electronics cooling In a typical data center, the thermal management of server electronics approximately consumes a third of the electricity used by the facility [ 1 , 2 ]. As a consequence of global demand for computing, an increase from about 152 billion kWh/year in 2005...

... ) . e-mail:  jaeholee@uci.edu 29 02 2020 16 05 2020 29 06 2020 thermal management electronics cooling heat guiding heterogeneous package Metamaterials are structures that are artificially engineered to obtain properties that are not available in nature. For instance...

... Study of Water Flow and Heat Transfer in Silicon Micro-Pin-Fin Heat Sinks ,” ASME J. Heat Transfer , 140 ( 12 ), p. 122401 . 10.1115/1.4040956 [10] Rachedi , R. , and Chikh , S. , 2001 , “ Enhancement of Electronic Cooling by Insertion of Foam Materials ,” Heat Mass Transfer...

... December 3, 2014. Assoc. Editor: Siddharth Bhopte. 22 02 2014 31 10 2014 03 12 2014 The paper reports the thermal performance of a nanofluid (MCNT/water) charged heat pipe with phase change material (PCM) as energy storage material (ESM) for electronic cooling. The adiabatic...

... designs critical for faster penetration of LED systems into general lighting applications. LED cooling natural convection heat sink chimney electronics cooling A19 bulb Over the last decade, LED lighting has been growing at a rapid rate, replacing many other traditional light sources...

... with significantly lower pressure drops. cooling 3D IC review single-phase cooling electronics cooling flow boiling microchannels A 3D IC architecture incorporates multiple device layers that are interconnected through vertical interconnects to extend the performance of a 2D chip. A high level...

... of 34 kPa as compared to a temperature variation of 38 K and a pressure drop of 144 kPa with continuous fins and 51 K and 21 kPa for a smooth flow channel. 3D IC electronics cooling numerical simulation temperature nonuniformity pressure drop High heat flux removal from evolving IC...

..., especially in the area of nanocomposites, to deliver technologically viable thermoelectric coolers with an effective Z T > 2 . electronics cooling thermal analysis MEMS cooling electronics packaging 13 07 2010 01 09 2010 23 11 2010 23 11 2010 2010...

... designs, which minimize adverse scaling phenomena. 09 06 2009 26 01 2010 19 05 2010 19 05 2010 blades centrifugal casting cooling fans miniature fans centrifugal flow blade design scaling phenomena electronics cooling Continual advancements...

... foam graphite foam electronics cooling Commercially produced metal foams are typically made from aluminum, nickel, steel, copper, and some of their alloys. These materials are known to have high thermal conductivities. This class of porous media has many practical applications including...

... 2007 04 02 2008 coatings cooling electronics packaging evaporation heat conduction microprocessor chips pool boiling microporous enhancement electronics cooling heat spreader experimental Historically the power dissipated from a microprocessor has increased with its...

... pressure drop at moderate and high pin spacing, but have only minor influence on heat transfer. 24 10 2004 30 07 2005 thermal management (packaging) integrated circuit packaging heat sinks cooling pin fins heat sink bypass tip leakage electronics cooling Overall...

... Impinging Gas Jets and Solid Surfaces ,” Advances in Heat Transfer , Academic , Orlando , Vol. 13 , pp. 1 – 60 . Amano , R. S. , 2000 , “ Electronic Cooling Technology with the Use of Turbulent Impinging Jets ,” Proceedings of the 2000 International Conference on Thermal Mechanics...

... and Photonic Packaging Conference, INTERpack ’97, Kohala Coast, Island of Hawaii, June 15–19. 26 February 2002 10 06 2003 thermal resistance integrated circuit packaging thermal management (packaging) Conduction Electronics Cooling Heat Spreaders Heat Sinks Spreading...

... confined flow stagnation flow Jet Impingement Air Jets Multiple Jets Electronics Cooling The enhanced heat and mass transfer rates obtained through the use of impinging jets have made them an attractive alternative in industrial applications ranging from the annealing of steel...

.... 01 February 1999 01 December 1999 Electronics Cooling Jet Impingement Air Suction Pull and Push Modes Air Jets Confined Jets Heat Sinks Pin Fins The experiments were conducted in the same facility as used in previous studies (Brignoni and Garimella 4 ; Schroeder...