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Keywords: energy release rate
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031004.
Published Online: September 14, 2011
... impact loading. In the approach, the intermetallic compound layer/solder bulk interface is modeled by the cohesive zone model, and the crack driving force in the intermetallic compound layer is evaluated by computing the energy release rate. The numerical simulation of a board level package under drop...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2010, 132(1): 014501.
Published Online: February 25, 2010
...Wei Wang; Yong Huang; Nicole Coutris; Hongseok Noh; Peter J. Hesketh The transverse shear effect has been frequently ignored in determining the debonding-related energy release rate and the phase angle in the blister test, resulting in underestimated values. This study aims to study the effect...