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Journal Articles

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Xinyue Wang, Zejun Zeng, Guoqi Zhang, Jing Zhang, Pan Liu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041013.
Paper No: EP-21-1109
DOI: https://doi.org/10.1115/1.4053432
Published Online: February 1, 2022
...@fudan.edu.cn 19 06 2021 14 12 2021 01 02 2022 power electronic packaging epoxy-based nano silver paste low-temperature joint technology pressure-less sintering Fudan University 10.13039/501100003347 19DZ2253400 Fudan University 10.13039/501100003347 20549...
View Article titled, Joint Analysis and Reliability Test of <span class="search-highlight">Epoxy</span>-<span class="search-highlight">Based</span> <span class="search-highlight">Nano</span> <span class="search-highlight">Silver</span> <span class="search-highlight">Paste</span> Under Different Pressure-Less Sintering Processes
Click here to open pdf in another window PDF for Joint Analysis and Reliability Test of <span class="search-highlight">Epoxy</span>-<span class="search-highlight">Based</span> <span class="search-highlight">Nano</span> <span class="search-highlight">Silver</span> <span class="search-highlight">Paste</span> Under Different Pressure-Less Sintering Processes
Topics: Epoxy resins, Pressure, Silver, Sintering, Temperature, Reliability, Shear strength, Epoxy adhesives, Shear (Mechanics)