...Xin Wei; Sa'd Hamasha; Ali Alahmer; Mohamed El Amine Belhadi One of the crucial factors in determining the reliability of an electronic device is fatigue failure of the interconnecting solder joints. In most cases, large bulk samples are used to study the fatigue characteristics of the solder...

... (LTS) alloys have recently received considerable attention because of their low cost and reduced defects in complex assemblies. The shear and fatigue properties of individual solder joints were tested using an Instron micromechanical testing system in this research. Two novel solder alloys (Sn-58Bi...

... a bending radius of 3 mm, due to cracking of the Si die. For the bending fatigue test, the electrical resistance increases after 2000 cycles in 5 mm bending radius, due to fatigue failure of the metal line and bump array. Both the maximum bendability and fatigue lifetime can be significantly improved...

... and fatigue properties of the actual solder joint structure have not been studied for these new alloys. In this paper, a cyclic fatigue test was conducted on individual real solder joints of different alloys, including SnAgCu, SnCu–Bi, SnAgCu–Bi, and SnAgCu–BiSb. The fatigue property of those solder joints...

...Qiming Zhang; S. W. Ricky Lee Repeated loading is an important reason to cause pad cratering fatigue failure in ball grid array (BGA) device in printed circuit board (PCB) assembly. For industry application, the board level drop test is commonly applied to evaluate the pad cratering fatigue...

...Sinan Su; Francy John Akkara; Ravinder Thaper; Atif Alkhazali; Mohammad Hamasha; Sa'd Hamasha Fatigue failure of solder joints is one of the major causes of failure in electronic devices. Fatigue life prediction models of solder joints were first put forward in the early 1960s, and since...

...B. Fiedler; M. Fine; K. Kao; L. Keer References [1] Kanchanomai , C. , and Mutoh , Y. , 2007 , “ Fatigue Crack Initiation and Growth in Solder Alloys ,” Fatigue Fract. Eng. Mater. Struct. , 30 , pp. 443 – 457 . 10.1111/j.1460-2695.2006.01088.x [2] Lee , K. O. , Yu...

...Ken-ichi Ohguchi; Katsuhiko Sasaki We previously proposed an elastic-plastic-creep model to estimate the fatigue strength of lead-free solder joints subjected to cyclic thermal loading. The proposed model requires detailed experimental data regarding the time-independent plastic strain and the time...

...-domain approach, reported by Upadhyayula and Dasgupta (1998, “Guidelines for Physics-of-Failure Based Accelerated Stress Test,” Proceedings, Reliability and Maintainability Symposium, pp. 345–357 ), was adapted in this study for the fatigue analysis. The test board consists of daisy-chained components...

..., which focuses on the details of damage initiation and propagation in the individual solder ball. The local model is error seeded with voids based on cases selected in experiment. The damage propagation rate is monitored for all the cases. The technique used to quantify cyclic creep-fatigue damage...

...David M. Pierce; Sheri D. Sheppard; Arlo F. Fossum; Paul T. Vianco; Mike K. Neilsen A unified creep plasticity damage (UCPD) constitutive model was developed to predict the fatigue of 95.5Sn–3.9Ag–0.6Cu solder joints. Compression, stress-strain and creep properties were generated in previous...

...Steven Murray; Craig Hillman; Michael Pecht One possible failure mechanism of products containing polyimide dielectric is deadhesion of polyimide from neighboring metallization. Deadhesion usually occurs due to the combined damage mechanisms of environmental aging and fatigue. In this paper...

... assembly. The procedure is conducive to the numerical assessment of fatigue lives of electronic packages. Corbin , J. S. , 1994 , “ Finite Element Analysis of Solder Ball Connect (SBC) Structural Design Optimization ”, IBM J. Res. Dev. 0018-8646 , 37 ( 5 ), pp. 585 – 596 . Hsu , S...

...C. Basaran; Y. Zhao; H. Tang; J. Gomez Sn-Pb eutectic solder alloy is extensively used in microelectronics packaging interconnects. Due to the high homologous temperature, eutectic Sn-Pb solder exhibits creep-fatigue interaction and significant time-, temperature-, stress-, and rate-dependent...

...Xianjie Yang; C. L. Chow; K. J. Lau In this paper, a semi-implicit time integration scheme has been developed for a damage-coupled constitutive model to characterize the mechanical behavior of 63Sn-37Pb solder material under thermo-mechanical fatigue (TMF) loading. The scheme is developed...

... a constitutive model for solder which couples viscoplasticity with a unified damage theory. The unified damage theory is characterized by a damage surface in strain space which separates fatigue damage from inelastic damage. The damage evolution equations are derived within the framework of irreversible...

...X. J. Zhao; G. Q. Zhang; J. F. J. M. Caers; L. J. Ernst In this paper, an “interfacial boundary volume” based damage criterion was proposed in combination with the modified Coffin-Manson model to predict solder fatigue. This criterion assumes that mainly, the behavior of the thin solder layer...

...Chang-An Yuan, Research Assistant; Kou-Ning Chiang, Professor Due to the CPU limitation of the computer hardware currently available, the three-dimensional full-scaled finite element model of wafer level packaging is impractical for the reliability analysis and fatigue life prediction. In order...

..., and Q = 44.9 kJ / mol for Sn63Pb37. Microstructural analyses indicated that small precipitates of Ag 3 Sn and η - Cu 6 Sn 5 intermetallics are responsible for the high values for n and Q that were found for the Sn96.5Ag3.5 and Sn95.5Ag4Cu0.5. The crack growth rate was determined by isothermal fatigue...

.... The resistance of these interfaces to crack growth was tested under both static and cyclic loading in high and low humidity test environments. These tests allowed the separation of the effects on crack growth due to stress corrosion and cyclic fatigue . Experimental results showed that the density of primary...