... nanoindentation experiments on copper specimens McElhaney et al. ( 2 ) identified a dependence of measured hardness on the indentation depth. Stolken and Evans ( 3 ) found a dependence of bending moment on the thickness as beam thickness went from 50 μ m to 12.5 μ...

.... (ii) The stress sensitivity decreases after stress relaxation in nanoindentation creep tests. The saturated value is 1 in three solder balls. (iii) The morphology of indented surface consists of three parts: initial indentation, power-law creep, and granular surface. It suggests that the transition...

... and the hardness. An important assumption in the analysis of the indentation is that the indented medium is a semi-infinite plane or half space, i.e., it has an “infinite thickness.” In nanoindentation the analyzed material is often a thin film that is deposited on a substrate. If the modulus ratio is small, (soft...

... ( ∼ 18 days); have been studied by an analysis using micro-shear testing and nano-indentation techniques. The shear test of the aged bumps showed a slight increase in shear strength after an initial period of aging ( ∼ 50 hours) as compared to the non-aged bumps, but a decrease after longer aging (e.g...

... of a thin SiLK film on a silicon substrate. Indentation-creep experiments show that this SiLK film indeed responds in a viscoelastic way. This may be caused by the non fully cross-linked test samples prepared using nonstandard processing. Using the FEM simulation, we find that the behavior of this thin SiLK...

... received Oct. 2003. Associate Editor: B. Michel. 01 Oct 2003 30 04 2004 gold lead bonding wires (electric) indentation crystal microstructure recrystallisation differential scanning calorimetry hardness elastic moduli yield strength yield stress secondary ion mass spectra...

... in the ceramic layers. There is reasonably good overall agreement between the residual stresses obtained from the indentation experiments and the numerical simulations. Some discrepancies do exist, though, for measurements on cross-sectioned MLCC’s. Possible reasons for the differences are discussed...

... has also been employed to slice other brittle materials such as alumina, quartz, glass, and ceramics. The manufacturing process of wiresaw is a free abrasive machining (FAM) process. Specifically, the wiresaw cuts brittle materials through the “rolling-indenting” and “scratch-indenting” processes...