...- induced stresses dominate. 31 03 2010 06 06 2011 14 09 2011 14 09 2011 finite element analysis integrated circuit packaging integrated circuit reliability Raman spectroscopy three-dimensional integrated circuits 3D packaging has spurred significant research...

.../1.1669118 11 08 2010 26 03 2011 23 06 2011 23 06 2011 automatic optical inspection computerised tomography crack detection flip-chip devices integrated circuit interconnections integrated circuit reliability integrated circuit testing microcracks nondestructive...

... . 16 01 2010 18 05 2010 23 06 2010 23 06 2010 cooling integrated circuit packaging integrated circuit reliability thermal management (packaging) In recent years, cooling of high heat flux systems such as computer microprocessors and memory have become global...

... 19 03 2010 19 03 2010 integrated circuit design integrated circuit packaging integrated circuit reliability integrated circuit testing life testing printed circuit design printed circuit testing semiconductor device packaging semiconductor device reliability This book...

...-chip devices integrated circuit reliability shrinkage thermal expansion 2010 American Society of Mechanical Engineers ...

... 04 03 2010 04 03 2010 finite element analysis integrated circuit reliability solders wafer level packaging Wafer-level chip scale packages (WCSPs) are gaining momentum in the market place recently ( 1 ). This is mainly due to low cost and good electrical performance. From...

...-free solder strain rate effect tensile strength split Hopkinson tensile bar electronic products fractography integrated circuit packaging integrated circuit reliability solders stress-strain relations tensile strength tin compounds 19 06 2008 13 03 2009 16 06 2009...

... integrated circuit packaging integrated circuit reliability life testing silver alloys solders stress-strain relations tin alloys The DLS test vehicle has two solder joint arrays, each composed of nine joints, which are built into an aluminum alloy assembly such that, under tension...

... finite element analysis high-speed techniques image sensors impact testing integrated circuit interconnections integrated circuit layout integrated circuit measurement integrated circuit modelling integrated circuit reliability integrated circuit testing mobile handsets soldering drop...

... ball grid arrays ceramic packaging computational fluid dynamics deformation finite element analysis flip-chip devices integrated circuit interconnections integrated circuit packaging integrated circuit reliability light interferometry plastic packaging thermal expansion thermomechanical...

... in IC Chips Using Raman Spectroscopy ,” Proceedings of the Material Research Society Meeting , Apr., San Francisco, CA . 01 10 2007 08 09 2008 13 11 2008 atomic force microscopy integrated circuit reliability nanoelectronics nanowires phase transformations Raman...

... integrated circuit layout integrated circuit reliability thermal stress cracking viscoelasticity In Part 1 of this paper, various failure mechanisms associated with the short-time wave propagation in the flip chip ball grid array (BGA) with an elastic underfill were investigated. As material...

... circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder acceleration factors cohesive zone modeling 2008 American Society of Mechanical Engineers ...

... 09 04 2007 finite element analysis integrated circuit interconnections integrated circuit reliability integrated circuit testing low-k dielectric thin films Power and latency are fast becoming major bottlenecks in the design of high performance microprocessors and computers...

... thermal cycles (e.g., 2000 cycles with no failure or 2500 cycles with less than 1% failure rate). automotive electronics ball grid arrays chip scale packaging integrated circuit interconnections integrated circuit reliability printed circuits 29 12 2004 07 03...

... accelerated thermal cycling. 20 09 2006 13 02 2007 ball grid arrays electronics packaging fatigue testing heat treatment integrated circuit reliability light interferometry solders accelerated thermal cycling laser moiré interferometry Microelectronic packaging industry...

... the steady state of testing, the temperature gradients even out and the resistance value decreases. 11 01 2006 27 10 2006 adhesive bonding flip-chip devices integrated circuit reliability flip chip anisotropic conductive adhesive FR-4 sequential build-up process reliability...

... 03 06 2005 silicon conducting polymers polymer films aluminium chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive bonding integrated circuit interconnections integrated circuit metallisation integrated circuit reliability contact resistance...

... 2004 15 November 2004 03 06 2005 chip-on-board packaging integrated circuit packaging light interferometry integrated circuit testing integrated circuit reliability integrated circuit interconnections flip-chip devices failure analysis thermal analysis delamination adhesive...

..., 2004. Review conducted by: Y. C. Chan. 13 January 2004 23 June 2004 03 06 2005 silicon compounds flip-chip devices resins integrated circuit packaging integrated circuit reliability integrated circuit interconnections nanotechnology soldering thermal expansion...