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Keywords: intermetallic compounds
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031004.
Published Online: September 14, 2011
... impact loading. In the approach, the intermetallic compound layer/solder bulk interface is modeled by the cohesive zone model, and the crack driving force in the intermetallic compound layer is evaluated by computing the energy release rate. The numerical simulation of a board level package under drop...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 365–369.
Published Online: December 22, 2004
.... In this paper the dissolution kinetics of Sn3.5Ag solder on the electrolytic Ni and electroless NiP layer are investigated. It is found that during 1 min reflow the electrolytic Ni layer dissolves much less than the electroless NiP layer due to the formation of Ni 3 Sn and Ni 3 Sn 2 intermetallic compounds...