1-1 of 1
Keywords: joint reliability
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041016.
Paper No: EP-21-1159
Published Online: March 31, 2022
... layer joint reliability A typical electronic device is made up of integrated chips, passive devices and interconnections. For interconnections, ball grid array (BGA) is commonly used as they are simple in design, see Fig. 1 . In this arrangement, the joints are of the shape of solder bumps...