... o dependence upon Re, H/B, and B. confined impinging slot jet milliscale jet flows fully developed velocity profile laminar flow uniform heat flux Nusselt number As miniaturization and power requirements continue to progress, millimeter-scale and microscale electronic circuit...

... , symmetry # 2 , wall # 1 , and wall # 2 in Fig. 3 . Friction factor in developing laminar flow ( s / W = 1 ) The outcomes of the numerical solution can be compared with the findings of Bejan and Sciubba [( 1 )] and Yüncü and Ekici [( 7 )]. It can...

... properties and develop further simulations of natural convection of nanofluids. However, numerical simulations in such complex problems require much longer computation time and memory allocation. computational fluid dynamics cooling copper electronics packaging laminar flow nanofluidics natural...

... impact of the amount of the vapor phase in the two-phase mixture on the pressure drop across the micropin-fin array. For a fixed x e , Δ P tp increases appreciably with increasing G max . 06 08 2008 06 01 2009 03 04 2009 drops laminar flow...

.... Design points are chosen through a three-level fractional factorial design of sampling methods. Navier–Stokes and energy equations for steady, incompressible, and laminar flow and conjugate heat transfer are solved at these design points using a finite volume solver. Solutions are carefully validated...

...Manu Mital; Elaine P. Scott This paper presents a thermal design methodology for an integrated power electronic module (IPEM) using embedded, single-phase, and laminar-flow rectangular microchannels. Three-dimensional packaging of electronic components in a small and compact volume makes thermal...

...Zhipeng Duan; Y. S. Muzychka The performance of impingement air cooled plate fin heat sinks differs significantly from that of parallel flow plate fin heat sinks. A simple impingement flow pressure drop model based on developing laminar flow in rectangular channels is proposed. The model...

... A 1040-7782 , 45 , pp. 1 – 20 . 22 11 2005 03 07 2006 heat sinks cooling channel flow heat transfer laminar flow integrated circuit packaging heat transfer channel flow dimple numerical model microelectronic cooling Spherical wells...

...X. J. Wei; Y. K. Joshi; P. M. Ligrani Steady, laminar flow and heat transfer, inside a rectangular microchannel with a dimpled bottom surface, are numerically studied. The microchannel is 50 × 10 − 6 m ( 50 μ m ) deep and 200 × 10 − 6 m ( 200 μ m ) wide. The dimples are placed in a single row along...

... thermal resistance was a maximum of 2.6% in the validation tests. Using a simple thermal resistance model based on developing laminar flow in rectangular channels, the actual mean heat transfer coefficients are obtained in order to develop a simple heat transfer model for the impingement plate fin heat...

... commercial CFD package. Numerical simulations were performed assuming laminar flow and no radiation heat transfer in the 1 ∕ 4 symmetry solution domain shown in Fig. 4b . An isothermal source, T i = 40 ° C , was located at the x = 0 boundary and an isothermal condition...

... sinks laminar flow heat transfer constructal theory constructal network loops complexity temperature Heat sinks incorporating microchannels, introduced by Tuckerman and Pease ( 1 ), are an attractive design option which increases the convective heat transfer coefficient, as well...

... in a channel with a constant cross section can be divided into two regions: a developing region, where the velocity profile changes from some initial profile to an invariant one downstream, and a fully developed region, where the velocity profile is independent of stream-wise distance. For laminar flow...

... October 8, 2003; revision received June 14, 2004. Review conducted by: Z. Suo. 08 October 2003 14 June 2004 24 01 2005 thermal management (packaging) chip scale packaging natural convection thermal analysis laminar flow coolants water numerical analysis surface mount...

...H. Bhowmik; C. P. Tso; K. W. Tou Steady-state experiments are performed to study the convection heat transfer from four in-line simulated chips in a vertical rectangular channel using water as the working fluid. The experimental data cover a wide range for laminar flow under natural, mixed...

... the wide range of laminar flow regime with Reynolds number, based on heat source length, from 800 to 2625. The applied uniform heat flux ranges from 1 to 7 W ∕ cm 2 . For flush-mounted heaters the heat transfer characteristics are studied and correlations are presented for four chips as well as for overall...

... of three popular two-phase pressure drop models and correlations were compared to micro-channel water data, and only a separated flow (Lockhart-Martinelli) correlation based on the assumption of laminar flow in both phases gave acceptable predictions. Several popular heat transfer correlations were also...

... convection cooling external flows pulsatile flow pipe flow channel flow boundary layers laminar flow Design is the permanent struggle for better and better global system performance, under imposed constraints. This paper reviews a body of electronics cooling results that illustrate how...

... 2001 10 06 2003 natural convection heat sinks thermal management (packaging) thermal analysis optimisation specific heat integrated circuit packaging laminar flow Heat Sink Rectangular Plate-Fin Natural Convection Least-Material Optimization The exponential increase...

... 1.5 percent for the plate AR = 0 . The improved agreement at low aspect ratio cuboids can primarily be attributed to the added confidence in the numerical data for low profile bodies. The equivalent flat plate model provides a convenient method for approximating laminar, flow over...