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Keywords: lead-free
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031008.
Paper No: EP-23-1044
Published Online: March 13, 2024
... This work is in part a work of the U.S. Government. ASME disclaims all interest in the U.S. Government's contributions. 27 04 2023 28 01 2024 13 03 2024 solders lead-free creep Garofalo microstructure creep Solder alloys are used in a variety of electronic...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011010.
Paper No: EP-14-1001
Published Online: March 1, 2015
... fillet failures. The second-level interconnects may be experience high strain rates and accrue damage during repetitive exposure to mechanical shock. Industry migration to lead-free solders has resulted in proliferation of a wide variety of solder alloy compositions. One of the popular tin-silver-copper...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011011.
Published Online: March 19, 2012
...Hung-Jen Chang; Chau-Jie Zhan; Tao-Chih Chang; Jung-Hua Chou In this study, a lead-free dummy plastic ball grid array component with daisy-chains and Sn 4.0 Ag 0.5 Cu Pb-free solder balls was assembled on an halogen-free high density interconnection printed circuit board (PCB) by using Sn 1.0 Ag...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021001.
Published Online: June 22, 2011
...M. Meilunas; P. Borgesen The mandated switch of the overwhelming part of microelectronics assembly to lead-free soldering has left the manufacturers of many high reliability products, which are still exempt from the requirement to change, with a choice between imperfect alternatives. One...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011013.
Published Online: February 18, 2009
... for 6.35 × 6.35 × 0.6 mm 3 flip chips and flip chips (“SiMAF;” Siemens AG) with lead-free solder bumps. Board layouts: ( a ) test vehicle Ι and ( b ) test vehicle II Schematic of open bump locations Excitation and detection patterns: ( a ) test vehicle Ι and ( b ) test vehicle II...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011002.
Published Online: February 11, 2009
...Mohd F. Abdulhamid; Cemal Basaran Thermomigration experiments were conducted to study the change in mechanical properties of 95.5Sn–4Ag–0.5Cu (SAC405) lead-free solder joint under high temperature gradients. This paper presents some observations on samples that were subjected to 1000 ° C / cm...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 273–277.
Published Online: September 8, 2006
... of the ball, durability increases. For voids bigger than that, the durability starts to decrease. This study also confirms that as voids are located closer to the damage initiation site and the propagation path, their lifespan decreases. FEA voids lead-free thermomechanical durability 03 02...