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Keywords: lead-free solder
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021002.
Paper No: EP-17-1123
Published Online: March 1, 2019
... ]. With the RoHS directive preventing the use of lead (Pb), lead-free solder joint fatigue in severe temperature environments has been widely studied among the electronic industry and academics [ 2 ]. Several fatigue models based on different fatigue criteria have therefore been developed over the years to assess...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031006.
Published Online: July 18, 2012
.... , and Wang , S. L. , 2003 , “ Fatigue Crack Growth Behavior of Sn–Pb and Sn-Based Lead-Free Solders ,” Eng. Fract. Mech. , 70 , pp. 2187 – 2197 . 10.1016/S0013-7944(02)00252-7 [9] Pringle , Raghavan , and Malatkar , 2007 , “ Solder Joint Reliability of BGA Package Under End-User Handling...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031003.
Published Online: July 18, 2012
... Based Lead Free Solder Joints ,” 11th Electronics Packaging Technology Conference , Singapore , pp. 283 – 291 . [5] Pang , H. L. , and Che , F. X. , 2006 , “ Drop Impact Analysis of Sn-Ag-Cu Solder Joints Using Dynamic High Strain Rate Plastic Strain as the Impact Driving Force...
Journal Articles
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
Published Online: April 15, 2008
... circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder acceleration factors cohesive zone modeling Solder joint fatigue has been the subject of a great deal...
Journal Articles
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 365–369.
Published Online: December 22, 2004
... compounds tin alloys silver alloys electrochemical machining dissolving dissolution of Ni and NiP layers lead-free solder intermetallic compounds Soldering is the most important method for joining components in electronics. Every component has at least two contacts to be joined...