1-9 of 9
Keywords: microfluidics
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041009.
Published Online: November 24, 2010
.... diamond fluid oscillations gold heat pipes microfluidics pipe flow thermal management (packaging) thermal resistance 06 04 2010 31 07 2010 24 11 2010 24 11 2010 2010 American Society of Mechanical Engineers ...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031002.
Published Online: September 8, 2010
... ) of the conventional TEC as a function of r o c 05 11 2009 20 04 2010 08 09 2010 bismuth compounds contact resistance cooling Ge-Si alloys heat transfer microfluidics micromechanical devices Peltier effect refrigeration refrigerators semiconductor device models...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021010.
Published Online: April 3, 2009
... microfluidics two-phase flow Two-phase micropin-fin heat sinks that utilize arrays of microsize pin-fin as internal heat transfer enhancement structures and capitalize on latent heat exchange associated with liquid flow boiling have recently emerged as a promising alternative to the popular two-phase...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 353–359.
Published Online: February 20, 2006
... , Marcel Dekker Inc. , New York . Kim , S. , and Lee , S. , 1996 , Air Cooling Technology for Electronic Equipment , CRC Press , Boca Raton, FL. Wang , Y. , Bidstrup , S. , Yuan , G. , and Allen , M. , 2002 , “ Printed-Wiring-Board Microfluidics for Thermal...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 503–511.
Published Online: April 20, 2005
...Jivtesh Garg; Mehmet Arik; Stanton Weaver; Todd Wetzel; Seyed Saddoughi Microfluid devices are conventionally used for boundary layer control in many aerospace applications. Synthetic jets are intense small-scale turbulent jets formed from periodic entrainment and expulsion of the fluid in which...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 381–390.
Published Online: December 17, 2004
... procedure. 25 02 2004 17 12 2004 thermal management (packaging) heat sinks integrated circuit packaging two-phase flow microfluidics channel flow coolants Thermal engineers in the electronics industry are facing unprecedented challenges of removing enormous amounts of heat...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 141–146.
Published Online: August 9, 2004
...Kazuyoshi Fushinobu; Masashi Nakata A microfluidic mixing device for microsystems with electroosmotic flow (EOF)-driven liquid pumping is proposed and examined experimentally and numerically. Microchannels with SiO 2 or Al 2 O 3 wall are fabricated by using surface micromachining technique...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2005, 127(3): 357–361.
Published Online: August 5, 2004
... including the height, size, and spacing of the roughness elements on the Poiseuille number. The fluid temperature effects are also investigated numerically for the rough channels. 06 04 2004 05 08 2004 channel flow microfluidics Poiseuille flow friction surface roughness thermal...