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Keywords: molecular dynamic simulations
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2006, 128(1): 92–97.
Published Online: May 10, 2005
... temperature drop. 23 07 2004 10 05 2005 carbon nanotubes thermal conductivity thermal management (packaging) heat sinks thermal management carbon nanotubes thermal interface material (TIM) numerical modeling analytical modeling molecular dynamic simulations Thermal...
