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Keywords: multichip modules
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011006.
Published Online: February 12, 2009
...Dapeng Zhu; Xiaoqin Lin; Le Luo The aim of this work is to evaluate the changes in microstructures and electrical properties of a tantalum nitride (Ta–N) thin film integrated on an aluminum anodization multichip module deposited (MCM-D) substrate. A Ta–N resistor with a thickness of 100 nm...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 256–259.
Published Online: April 16, 2007
... to deal with geometries that can be decomposed into boxes. 05 01 2006 16 04 2007 integrated circuit packaging multichip modules thermal analysis Using the above Green’s function, as well as the Green’s theorem, Eq. 3a can be transformed into 3.2 T ( r ) − T av...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 400–410.
Published Online: December 28, 2006
...C. J. Fang; M. C. Wu; Y. M. Kuo; C. Y. Lee; C. H. Peng; Y. H. Hung A series of experimental investigations on the studies related to fluid flow and transient mixed convection from a horizontally unconfined stationary or rotating ceramic-based multichip module (MCM) disk with unconfined jet...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 287–290.
Published Online: August 24, 2006
... of metals is much lower than that of semiconductors and stress-induced resistivity change was not found in the MIM capacitors. 24 04 2006 24 08 2006 capacitors CMOS integrated circuits multichip modules system-in-package CMOS capacitor stress Current electronics...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 528–534.
Published Online: January 24, 2005
... fins k =thermal conductivity Re =Reynolds number based on the hydraulic diameter The current study deals with a numerical and experimental investigation of a very high aspect ratio heat sink, used for impingement air cooling of a multichip module. The heat sink was designed...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 159–172.
Published Online: April 30, 2004
... January 2003 01 November 2003 30 04 2004 multichip modules ceramic packaging heat transfer nozzles convection Recently, the demand for compactness and higher operational speeds has led to high power density in electronic packages. It is well-known that the failure...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 198–204.
Published Online: July 26, 2002
... . Manuscript received by the EPPD September 5, 2000. Associate Editor: B. Michel. 05 September 2000 26 07 2002 thermal management (packaging) integrated optoelectronics optical computing finite element analysis thermal analysis multichip modules heat sinks cooling...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 1–6.
Published Online: January 12, 2001
... manuscript received January 12, 2001. Associate Editor: G. De Mey. 29 June 1999 12 January 2001 filled polymers nanostructured materials capacitors multichip modules materials preparation electron device manufacture Passive components such as resistors, capacitors...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 247–254.
Published Online: September 1, 2000
.... Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Associate Technical Editor: Y. C. Lee multichip modules electric connectors printed circuit accessories electronic design automation finite element analysis quadratic...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 86–91.
Published Online: December 29, 1999
... 29 December 1999 stainless steel substrates multichip modules moire fringes Stainless steel offers numerous advantages over traditional electronic materials due to its superior strength-to-weight ratio, flexibility, corrosion resistance, impact strength, thickness, thermal...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 77–85.
Published Online: November 22, 1999
... OF ELECTRONIC PACKAGING . Manuscript received by the EEPD April 9, 1999; revision received November 22, 1999. Associate Technical Editor: M. Shiratori. 09 April 1999 22 November 1999 multichip modules dielectric thin films stainless steel substrates Stainless steel offers...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 115–120.
Published Online: November 9, 1999
...Yu-Jung Huang; Shen-Li Fu This paper introduces an algorithm that focuses on the placement of the power dissipating chips for multichip module applications. The main design issue is addressed on the chip placement to achieve uniform thermal distribution. Our approach to the placement problem...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 55–60.
Published Online: August 31, 1999
... functionality and adhesive reworkability is presented in this study. In addition, finite element modeling is used to predict the out-of-plane warpage, axial, and interfacial stresses of the tiles-on-pallet palletized assemblies. [S1043-7398(00)00501-6] multichip modules adhesives polymers thermal...