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Keywords: nickel compounds
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021004.
Published Online: April 1, 2009
... 11 2007 13 11 2008 01 04 2009 copper compounds electronics packaging fine-pitch technology laser beam applications nickel compounds silver compounds soldering tin compounds soldering laser lead-free solders QFP devices electronics assembly In recent years...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 365–369.
Published Online: December 22, 2004
...°C. An electrolytic Ni ∕ solder system has a relatively higher shear load, a lower dissolution rate of the Ni layer, and is more protective for the Cu layer during extended times of reflow. 05 08 2003 22 12 2004 ball grid arrays reflow soldering solders reliability nickel...