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Keywords: numerical modeling
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021002.
Published Online: May 20, 2010
... of up to 135% for the facility with 56% open tiles while the average and maximum changes for the facility with 25% open tiles are 6% and 60%, respectively. The perforated tile flow distributions obtained from different numerical models along with the experimental results are shown in Fig. 6 . For each...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2006, 128(1): 92–97.
Published Online: May 10, 2005
... temperature drop. 23 07 2004 10 05 2005 carbon nanotubes thermal conductivity thermal management (packaging) heat sinks thermal management carbon nanotubes thermal interface material (TIM) numerical modeling analytical modeling molecular dynamic simulations Thermal...
