...) 28 05 2010 24 08 2011 09 12 2011 09 12 2011 finite element analysis flip-chip devices optimisation In chip-to-substrate connections, the flip-chip connection has become important in high-performance packages due to its high density and low inductance, compared...

... computational fluid dynamics cooling light emitting diodes optimisation printed circuits semiconductor device packaging thermal management (packaging) light-emitting diode printed circuit board LED array thermal modeling Light-emitting diodes (LEDs) demonstrate a number of benefits...

... 05 2010 09 09 2010 09 09 2010 computational fluid dynamics convection cooling electronics packaging optimisation To address the issues of acoustic noise and energy expense associated with the use of cooling fans and to enhance operational reliability, natural convection...

... they require intensive computational effort. Advantages as well as disadvantages of these methods are discussed. 05 06 2007 06 12 2007 30 07 2008 design of experiments electronic design automation electronics packaging neural nets numerical analysis optimisation...

... couples and the area-to-height ratio of the thermoelectric pellet. In the present study, the optimization problems are solved numerically using the so-called multistart adaptive random search method. 28 07 2006 05 11 2006 cooling optimisation thermal resistance thermoelectric devices...

... flow simulation jets optimisation numerical analysis Enhancement of the cooling of electronic modules and packages can be accomplished by a variety of techniques, such as increasing the air flow rate, increasing the surface area through the use of heatsinks, or improving the air flow...

... regression analysis thermal resistance gradient methods sensitivity analysis optimisation optimal thermal design pin-fin heat sink DOE CCD RSM thermal resistance pressure loss mass constraint In recent years, the heat sink has become the most common thermal management hardware in use...

... , 7 ( 4 ), pp. 319 – 336 . 20 10 2003 16 11 2004 ball grid arrays thermal management (packaging) neural nets optimisation Multidisciplinary Design Electronics Packaging Neural Networks Design Optimization Ball Grid Array Current trends in electronics...

...: Z. Suo. 01 April 2003 01 January 2004 08 07 2004 integrated circuit interconnections integrated circuit packaging electroplating optimisation photolithography reliability integrated circuit reliability response surface methodology silicon thermal expansion wafer...

.... Dudek, B. Vandevelde, M. Meuwissen, A. Wymyslowski, G. Hanreich and E.H. Wong. L. J. Ernst G. Q. Zhang 15 12 2003 thermal management (packaging) digital simulation optimisation micromechanical devices failure analysis ...

... 2001 10 06 2003 natural convection heat sinks thermal management (packaging) thermal analysis optimisation specific heat integrated circuit packaging laminar flow Heat Sink Rectangular Plate-Fin Natural Convection Least-Material Optimization The exponential increase...

... received by the EEPD August 30, 1999; revised manuscript received September 14, 2000. Associate Editor: J. Lau. 30 August 1999 14 September 2000 ball grid arrays plastic packaging optimisation finite element analysis matrix decomposition circuit analysis computing printed circuit...

... by the EEPD July 13, 1999; revised manuscript received February 25, 2000. Associate Technical Editor: B. Michel. 13 July 1999 25 February 2000 vibrations modal analysis supports optimisation printed circuit design In many engineering structures, one is normally interested...

...,” Paper AIAA-98-4974, pp. 2114–2123. printed circuits heat transfer cooling convection optimisation printed circuit design The optimal placement of components on printed wiring boards requires satisfying multiple, possibly conflicting, design objectives. As pointed out by Moresco 1...