... to like statistically stored dislocations ( 10 ). On the other hand, in the presence of nonuniform plastic deformation fields there are strain gradients that have to be accommodated by additional dislocations. These types of dislocations...

...Samuel I-En Lin Thermal residual plastic deformation of bond joints on thin film based DWDM module under thermal cycles loading was investigated using three-dimensional finite element analysis. Finite element simulations were carried out to investigate the effect of the 4 and 6 solder-joint designs...

... Editor: Guo-Quon Lu. 01 December 2003 01 March 2004 06 10 2004 solders thermomechanical treatment tin alloys silver alloys copper alloys plastic deformation viscoplasticity electronics packaging finite element analysis failure analysis Due to environmental...

... for accelerated thermal cycling and qualification. military avionics life testing creep plastic deformation ball grid arrays In this work, commercially-available Super Ball Grid Array (SBGA) packages are considered for military avionics applications. These SBGA packages are assembled on organic...

... affect the conditions for yielding and continued plastic deformation. Unfortunately, a more realistic full 3-D model of the solder structures in the package also requires the introduction of a 3-D interface crack into the solder/crack interaction model. Since most techniques readily available...

... of stability of the compressive force at the contact face between a chip bump and a substrate pad. The key factor that dominates the interconnection reliability during temperature cycling is the amount of plastic strain in the chip bump (gold bump) at the contact face. The plastic deformation of the chip bump...

... March 15, 2002. Associate Editor: D. T. Read. tin alloys lead alloys flip-chip devices chip-on-board packaging soldering thermal stress cracking plastic deformation acoustic microscopy inspection finite element analysis viscoelasticity viscoplasticity thermal expansion shear...

... scale packaging plastic deformation ball grid arrays flip-chip devices fatigue ductility stress-strain relations lead bonding integrated circuit interconnections finite element analysis Wafer Level Packaging Chip Scale Package Wire Interconnect Technology The function and design...

.... , Sprecher , A. F. , and Conrad , H. , 1992 , “ Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue ,” ASME J. Electron. Packag. , 114 , pp. 112 – 117 . Contributed by the Electronic and Photonic Packaging Division for publication...

... on the numerical results. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received at ASME Headquarters March 13, 2001. Associate Editor: Y. C. Lee. 13 March 2001 plastic deformation hardness lead bonding...

... , L. , and Fine , M. , 1997 , “ Creep, Stress Relaxation, and Plastic Deformation in Sn-Ag and Sn-Zn Eutectic Solders ,” J. Electron. Mater. , 26 , No. 7 , pp. 783 – 790 . Takemoto, T., Ninomiya, R., Takahashi, M., and Matsunawa, A., 1997, “Mechanical Properties and Estimation of Thermal...

... devices thermal stress cracking copper plastic deformation soldering Formation of solder bumps for flip chips may cause cracks in the chip around the UBM. Cracks occur after solder melting and subsequent cooling. As usual, cracks in a silicon die indicate that there are tensile stresses...

... that there is a true size-scale effect for fracture initiation. The energy of plastic deformation scales with deformed volume, whereas the energy of fracture scales with crack surface area. Plastic deformation becomes energetically favorable as the scale of deformation decreases, and there is a threshold volume below...

... 29 June 2000 tin alloys lead alloys eutectic alloys soldering fatigue plastic deformation finite element analysis Tin (Sn)–lead (Pb) alloys with near eutectic compositions have been widely used as soldering materials in the package of semiconductor and communication devices...

... mechanics circuit reliability printed circuits plastic deformation thermal stress cracking crack-edge stress field analysis delamination soldering finite element analysis The last decade witnessed an explosive growth in the research and development efforts devoted to solder bumped flip chips...

.... 29 November 1999 packaging thermal expansion finite element analysis thermal stresses plastic deformation Almost all electronic packages and assemblies contain components made of dissimilar materials having anisotropic time-dependent and temperature-dependent properties...