...Nobuyuki Shishido; Yutaka Hayama; Yuki Akinaga; Shinya Taketomi; Masaaki Koganemaru; Seiya Hagihara; Noriyuki Miyazaki Power modules are utilized to control electric power and play a key role in the systems for energy conversion. One of the reliability problems in power modules is the wire-liftoff...

...Mitsuaki Kato; Takahiro Omori; Akihiro Goryu; Tomoya Fumikura; Kenji Hirohata The larger current densities accompanying increased output of power modules are expected to degrade solder joints by electromigration. Although previous research has experimentally studied electromigration in solder, die...

... excellent heat dissipation and miniaturized system simultaneously. However, a traditional architecture of power module, direct bonding copper substrate, has serious warpage deformation and limitation of the heat dissipation. Therefore, a power module with an insulated metal substrate (IMS) is proposed...

...Mitsuaki Kato; Takahiro Omori; Akihiro Goryu; Tomoya Fumikura; Kenji Hirohata Power modules are being developed to increase power output. The larger current densities accompanying increased power output are expected to degrade solder joints in power modules by electromigration. In previous research...

...Noriyuki Miyazaki; Nobuyuki Shishido; Yutaka Hayama This paper reviews the previous research on the methodologies for evaluating structural integrity of wire bonds and die-attachments in power modules. Under power module operation, these parts are subjected to repeated temperature variations which...