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Journal Articles

Natural Convection and Passive Heat Rejection from Two Heat Sources Maintained at Different Temperatures on a Printed Circuit Board

Randy D. Weinstein, Amy S. Fleischer, Kimberly A. Krug
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 14–21.
https://doi.org/10.1115/1.1635393
Published Online: April 30, 2004
.... Vertical orientation increases the power dissipation in the components by up to 30% for the FR4 board and 15% for the copper clad board. Two ounces of copper cladding increases the overall power dissipation by 150–190%. 01 February 2003 30 04 2004 printed circuit layout thermal...
View Article titled, Natural Convection and Passive Heat Rejection from Two Heat Sources Maintained at Different Temperatures on a Printed Circuit Board
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Topics: Energy dissipation, Heat, Heat conduction, Natural convection, Printed circuit boards, Temperature, Copper
Journal Articles

On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate

Alfonso Ortega, Shankar Ramanathan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 235–243.
https://doi.org/10.1115/1.1569507
Published Online: June 10, 2003
... and R. Culham. 26 March 2002 10 06 2003 cooling packaging printed circuit layout forced convection Green's function methods temperature distribution finite element analysis Cooling Electronics Forced Convection Greens Functions Forced air cooling of electronic...
View Article titled, On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate
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Topics: Cooling, Electrical conductivity, Electronic components, Flow (Dynamics), Forced convection, Heat, Heat conduction, Heat transfer, Temperature, Thermal conductivity
Journal Articles

Factors Affecting the Operational Thermal Resistance of Electronic Components

Mark R. D. Davies, Reena Cole, John Lohan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 185–191.
https://doi.org/10.1115/1.1286101
Published Online: November 15, 1999
... OF ELECTRONIC PACKAGING . Manuscript received by the EEPD July 26, 1998; revised manuscript received November 15, 1999. Associate Technical Editor: R. Wirtz. 26 July 1998 15 November 1999 packaging thermal resistance forced convection plastic packaging printed circuit layout...
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Topics: Electronic components, Temperature, Thermal resistance, Junctions
Journal Articles

A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads

Kuo-Ning Chiang, Associate Professor,, Chang-Ming Liu, Graduate Assistant,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2001, 123(2): 127–131.
https://doi.org/10.1115/1.1339196
Published Online: August 19, 1999
... August 19, 1999. Associate Editor: S. Heinrich. 19 August 1999 ball grid arrays circuit reliability reflow soldering thermal stresses stress-strain relations finite element analysis contact angle printed circuit layout In the past few years, prediction of the manufacturing...
View Article titled, A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads
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Topics: Reliability, Shapes, Solders, Thermal stresses, Ball-Grid-Array packaging, Geometry, Reflow soldering, Finite element analysis, Design