... optical inspection computerised tomography crack detection flip-chip devices integrated circuit interconnections integrated circuit reliability integrated circuit testing microcracks nondestructive testing printed circuit manufacture solders synchrotron radiation thermal stress cracking X-ray...

... 01 02 2008 30 07 2008 assembling elasticity finite element analysis plasticity press fitting printed circuit manufacture press-fit assembly solderless technology finite element analysis elastic-plastic properties friction coefficient Due to concerns about...

... the adjoining plate ( 7 9 17 ), can yield acceptable accuracy in the prediction and optimization of the thermal performance of such configurations. substrate printed circuit boards (PCB) heated modules printed circuit manufacture cooling electronics packaging convection...

... assembling surface mount technology printed circuit manufacture ball grid arrays chip scale packaging finite element analysis bending failure analysis solders materials testing reliability The increasing demand for smaller and faster products in the electronics industry has encouraged...

... SAM1 is a commercial 25 μ m sample, SAM2 is 3 μ m in-house sample, SAM3 is a post-HF buffer solution release sample, and SAM4 is a post-KOH treated 3 μ m sample 13 02 2005 24 11 2005 printed circuit manufacture wireless sensor networks...

... circuit manufacture solders tensile testing printed circuit testing finite element analysis tin alloys silver alloys lead alloys failure analysis testing 62/63/2 solder in situ solder characterization area array package chips BGA printed wiring boards test methods failure modes...

... balls. 08 06 2004 21 12 2004 ball grid arrays creep solders soldering assembling printed circuit manufacture stress relaxation stress-strain relations tin alloys lead alloys silver alloys integrated circuit packaging finite element analysis creep strain rate 62%Sn–36...

... February 2003 01 February 2004 06 10 2004 thermal expansion printed circuit testing printed circuit manufacture finite element analysis thermoelasticity printed circuit design Printed circuit boards (PCB’s) are generally constructed using two types of routing strategies...

... and effectively modeled using the standard implicit time-integration code. 10 05 2004 17 07 2004 printed circuit manufacture electronics packaging bending finite element analysis heat transfer Electronic Packaging Drop Impact Dynamics Finite Element There has been increasing...

... captured. 21 01 2003 26 06 2004 printed circuits printed circuit manufacture thermal management (packaging) natural convection ball grid arrays printed circuit testing surface mount technology With ever-reducing product development cycle times preventing extensive...

... production planning manufacturing processes assembling soldering surface mount technology fine-pitch technology printed circuit manufacture integrated circuit reliability laser beam applications 01 March 2003 30 04 2004 Contributed by the Electronic and Photonic Packaging Division...

.... The final component of the solder paste is the vehicle system which provides suspending power for alloy particles and designated paste rheology (Hwang 1 ). reflow soldering surface mount technology printed circuit manufacture modelling heat transfer melting solidification cooling...

... 14 03 2003 plastic packaging assembling circuit reliability failure analysis ball grid arrays surface mount technology reflow soldering printed circuit manufacture wetting thermal stability inspection Defect PBGA Assembly Soldering Profile Surface Mount Technology...

.... Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division, December 3, 2001. Associate Editor: S. M. Heinrich. 03 December 2001 14 03 2003 fracture mechanics soldering printed circuit...

... mount technology printed circuit manufacture Taguchi methods design of experiments mechanical properties conducting polymers In order to identify the desirable formulation and the preferred material parameters of the electrically conductive adhesives under investigation, the design...

.... Associate Editor: Yi-Hsin Pao. 09 August 2000 26 07 2002 reflow soldering flip-chip devices creep chip scale packaging printed circuit manufacture integrated circuit reliability life testing integrated circuit testing By IPC’s definition, holes with 6 mils (0.15 mm...

... . Manuscript received by the EPPD December 7, 2000. Associate Editor: S. M. Heinrich. 07 December 2000 26 07 2002 fatigue circuit reliability printed circuit manufacture packaging production testing fracture Thin Films Flexible Printed Circuitry (FPC) High Cycle Fatigue...

... stress cracking printed circuit manufacture life testing production testing fracture mechanics finite element analysis creep fracture chip scale packaging reflow soldering There are at least two major reasons why directly attaching the solder bumped flip chip on PCB is not popular yet 1...

... 02 05 2002 creep chip scale packaging soldering printed circuit manufacture circuit reliability tin alloys silver alloys indium The unique physical and mechanical properties of the low-cost tin-lead solders have facilitated printed circuit board (PCB) assembly choices...

... thermal analysis wave soldering printed circuit manufacture stress analysis cooling circuit reliability Integrity of plated through holes (PTHs), as shown in Fig. 1 , has become one of the primary printed wiring board (PWB) reliability concerns either during the component assembly process...