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Keywords: reflow soldering
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021001.
Published Online: June 22, 2011
... that comparisons of test results may not reflect relative performances under service conditions. This was illustrated with for a set of model BGA components with 20 mil (0.5 mm) diameter SAC305 solder balls, which were reflow soldered onto printed circuit boards using a eutectic SnPb solder paste and tested...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041013.
Published Online: December 8, 2010
...) of chip during realignment 29 11 2009 25 09 2010 08 12 2010 08 12 2010 chip-on-board packaging Couette flow flip-chip devices interconnections reflow soldering solders viscosity wafer bonding flip chip no flow viscous misalignment self-alignment solder...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 331–338.
Published Online: September 29, 2005
... of the various approaches are mutually consistent. 29 12 2004 29 09 2005 flip-chip devices reflow soldering solders surface tension eutectic alloys As demands on the performance of computers, communication systems, and optoelectronic products rapidly increase, electronic packaging...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 541–545.
Published Online: January 24, 2005
... underfills into the flip chip bonding between solders and electroless Ni pads and investigated the integrity of the reflowed solder interconnects. The reliability of these types of flip chip packages under thermal cycling was conducted. Computational modeling was performed to explain the experimental results...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 446–451.
Published Online: January 13, 2005
... of the package was 892 h, and the average ultimate service time of the package was 1053 h. 17 08 2004 13 01 2005 metallisation reliability integrated circuit packaging reflow soldering testing tin aluminium alloys nickel alloys vanadium alloys copper alloys dies (machine tools...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 440–445.
Published Online: January 4, 2005
... 04 01 2005 solders cooling flip-chip devices melting microassembling directional solidification integrated circuit packaging voids (solid) lead alloys tin alloys silver alloys reflow soldering In a flip chip assembly, the solder joints connecting the chip and its circuit...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 365–369.
Published Online: December 22, 2004
...°C. An electrolytic Ni ∕ solder system has a relatively higher shear load, a lower dissolution rate of the Ni layer, and is more protective for the Cu layer during extended times of reflow. 05 08 2003 22 12 2004 ball grid arrays reflow soldering solders reliability nickel...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 290–298.
Published Online: October 5, 2004
... Microelectronics Micro Lead Frame Packaging Perzyna Rigid Plastic Solder Joints Shape Standoff Height Surface Evolver Viscoplastic Von Mises Warpage ball grid arrays integrated circuit reliability viscoelasticity reflow soldering surface tension wetting finite element analysis 18 04...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 120–126.
Published Online: May 18, 2004
... , “ Voiding in BGA at Solder Bumping Stage ,” ISHM Proceedings of Microelectronics and Packaging Conference , Philadelphia, PA, pp. 462 – 471 . Chan , Y. C. , Xie , D. J. , and Lai , J. K. L. , 1995 , “ Characteristics of Porosity in Solder Pastes during Infrared Reflow Soldering ,” J...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 52–56.
Published Online: April 30, 2004
... issues. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received June 2003. Associate Editor: K. Kishimoto. 01 June 2003 30 04 2004 reflow soldering surface tension wetting thermomechanical...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 335–346.
Published Online: September 17, 2003
.... The final component of the solder paste is the vehicle system which provides suspending power for alloy particles and designated paste rheology (Hwang 1 ). reflow soldering surface mount technology printed circuit manufacture modelling heat transfer melting solidification cooling...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 329–334.
Published Online: September 17, 2003
... 2003 bubbles reflow soldering voids (solid) surface tension viscosity flip-chip devices microassembling integrated circuit packaging The reliability of solder bumps has become more critical as the components become smaller. Figure 1 shows a typical flip-chip assembly commonly...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 153–156.
Published Online: March 14, 2003
... will cause the interface in the solder joint to be more sensitive to stress 1 2 . Plastic BGA Solder Joint Cooling Rate Cu-Sn Intermetallics Intermetallic Compound Growth copper alloys tin alloys reflow soldering ball grid arrays plastic packaging annealing chemical interdiffusion...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
Published Online: March 14, 2003
... 14 03 2003 plastic packaging assembling circuit reliability failure analysis ball grid arrays surface mount technology reflow soldering printed circuit manufacture wetting thermal stability inspection Defect PBGA Assembly Soldering Profile Surface Mount Technology...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 39–43.
Published Online: March 14, 2003
.... 03 December 2001 14 03 2003 flip-chip devices reflow soldering inspection quality control light interferometry ultrasonic applications spectral analysis data acquisition time-domain analysis signal processing Consumer demands are driving the current trend...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 323–327.
Published Online: December 12, 2002
...Noriyasu Kawamura; Takashi Kawakami; Kikuo Kishimoto; Masaki Omiya; Toshikazu Shibuya Plastic encapsulated semiconductor packages may crack at the corner regions of die pads or chips if internal delamination occurs at an elevated temperature during the reflow soldering process. Thus, the structural...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 397–402.
Published Online: December 12, 2002
... flip-chip devices integrated circuit interconnections encapsulation integrated circuit packaging plastic packaging shear strength heat treatment interface structure reflow soldering surface chemistry As the trend in requirements of electronic packaging is toward higher I/O, greater...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 246–253.
Published Online: July 26, 2002
... Editor: S. M. Heinrich. 26 07 2002 integrated circuit reliability ball grid arrays reflow soldering thermal stress cracking plastic packaging integrated circuit modelling integrated circuit packaging Reliability is one of the major concerns for ball grid array (BGA...