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Keywords: solderability
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011103.
Paper No: EP-22-1013
Published Online: October 22, 2022
.... This allows RDL to be fabricated on a singulated chip. Nanosilver (nano-Ag) ink is printed on the silicon chip to form routing traces and bond pads. However, the Ag pad may be consumed by the solder quickly if the reflow process is not properly controlled. The mechanical integrity of the solder joint...
